Multi-height precision alignment with selectively developed alignment marks

Journal of Microelectromechanical Systems

Volumn 23, Issue 2, 2014, Pages 424-427

  Heymann, Michael ^a   Fraden, Seth ^a   Kim, Dongshin ^a  

^a BRANDEIS UNIVERSITY   (United States)

Author keywords

alignment; lithography; microelectromechanical systems; Microfabrication; microfluidics

Indexed keywords

ELECTROMECHANICAL DEVICES; LITHOGRAPHY; MEMS; MICROFABRICATION; MICROFLUIDICS; PHOTORESISTS;

ALIGNMENT MARKS; HIGH PRECISION ALIGNMENTS; LOW CONTRAST; PRECISION ALIGNMENT; THICK LAYERS; THICK RESIST; VISUAL CONTRAST;

ALIGNMENT;

EID: 84898494316     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2013.2279231     Document Type: Article

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