Structurally embedded electrical systems using ultrasonic consolidation (UC)

17th Solid Freeform Fabrication Symposium, SFF 2006

Volumn , Issue , 2006, Pages 70-83

  Siggard, Erik J ^a   Madhusoodanan, Anand S ^b   Stucker, Brent ^a   Eames, Brandon ^b  

^a Dept of Mechanical and Aerospace Engineering ^*  (United States)

^b Utah State University   (United States)

Author keywords

Electronics; Sensor; Structurally embedded; Ultrasonic consolidation

Indexed keywords

ALUMINUM; DELAMINATION; ELECTRONIC EQUIPMENT; SENSORS; ULTRASONICS;

BONDED ALUMINUM; ELECTRICAL SYSTEMS; LOWER TEMPERATURES; OPTIMAL BONDING; PARAMETER COMBINATION; ROOM TEMPERATURE; STRUCTURALLY EMBEDDED; ULTRASONIC CONSOLIDATION;

EMBEDDED SYSTEMS;

EID: 84898400935     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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