Performance of open-cell foam of Cu-Ni alloy integrated with graphene as a shield against electromagnetic interference

Materials Letters

Volumn 122, Issue , 2014, Pages 244-247

  Ji, Keju ^a   Zhao, Huihui ^a   Huang, Zhenggen ^a   Dai, Zhendong ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Electrodeposition; Electrophoresis; Foamed metal; Multilayered structure; Porous materials

Indexed keywords

BINARY ALLOYS; ELECTRODEPOSITION; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC SHIELDING; ELECTROMAGNETIC WAVE INTERFERENCE; ELECTROPHORESIS; GRAPHENE; NICKEL ALLOYS; POROUS MATERIALS; SHIELDING; SIGNAL INTERFERENCE;

ELECTROLESS COPPER PLATING; ELECTROPHORETIC DEPOSITIONS; FOAMED METALS; GRAPHENE NANOSHEETS; MULTI-LAYERED STRUCTURE; NICKEL ELECTROPLATING; SHIELDING EFFECTIVENESS; SHIELDING MATERIALS;

COPPER ALLOYS;

EID: 84897687637     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2014.02.025     Document Type: Article

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