Design to reliability shielded vertical interconnection applied to microwave Chip Scale Packaging

2000 30th European Microwave Conference, EuMC 2000

Volumn , Issue , 2000, Pages

  Monfraix, P ^a   Adam, T ^a   Lacoste, J L ^a   Drevon, C ^a   Naudy, G ^a   Cogo, B ^a   Cazaux, J L ^a   Roux, J L ^b  

^a THALES ALENIA SPACE   (France)

^b CNES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

RELIABILITY;

CHIP-SCALE PACKAGING; ELECTRICAL DESIGN; ELECTROMAGNETIC SIMULATION; RELIABILITY TEST; TEMPERATURE RANGE; TEST SAMPLES; VERTICAL INTERCONNECTIONS;

MICROWAVES;

EID: 84897490788     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMA.2000.338747     Document Type: Conference Paper

References (3)

1. "Multilayer printed circuit boards at 12-14 GHz with MCMs and MMICs", C. Drevon et al., 1999 Wireless Workshop proceedings, Gold Canyon, Arizona.
2. "Ball grid arrays: a DC to 31. 5 GHz low cost packaging solution for microwave and mm-wave MMICs", M. P. R. Panicker et al.; Microwave Journal, January 1998 issue.
3. "Development of CSP for microwave/millimetrewave applications'I K. Ikeda et al., 1999 Wireless Workshop proceedings, Gold Canyon, Arizona.