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Volumn , Issue , 2013, Pages

Security-enhanced 3D communication structure for dynamic 3D-MPSoCs protection

Author keywords

3D MPSoC; bus; Network on chip; performance; quality of service; security

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; BUSES; COMMUNICATION; COMPUTER VIRUSES; ELECTRONIC DATA INTERCHANGE; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; MULTIPROCESSING SYSTEMS; QUALITY OF SERVICE; SERVERS; SYSTEMS ANALYSIS; VLSI CIRCUITS;

EID: 84897423564     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SBCCI.2013.6644851     Document Type: Conference Paper
Times cited : (7)

References (10)
  • 1
    • 78649888644 scopus 로고    scopus 로고
    • Design and analysis of 3d-maps: A many-core 3d processorwith stacked memory
    • Healy, M. B. et al, "Design and analysis of 3D-MAPS: A many-core 3D processorwith stacked memory". In: Proc. (CICC), 2010.
    • (2010) Proc. (CICC)
    • Healy, M.B.1
  • 2
    • 84925333376 scopus 로고    scopus 로고
    • Enhancing noc components to support security
    • Lukovic S. et al, "Enhancing NoC components to support security"In Proc WESS2010
    • (2010) Proc WESS
    • Lukovic, S.1
  • 10
    • 79960300715 scopus 로고    scopus 로고
    • 3D integration for NoC-based SoC Architectures
    • Springer
    • Sheibanyrad, A. et al, "3D integration for NoC-based SoC Architectures". Integrated Circuits and Systems. Springer. 2011.
    • (2011) Integrated Circuits and Systems
    • Sheibanyrad, A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.