Fully integrated ASK receiver MMIC for terahertz communications at 300 GHz

IEEE Transactions on Terahertz Science and Technology

Volumn 3, Issue 4, 2013, Pages 445-452

  Song, Ho Jin ^a   Kim, Jae Young ^a   Ajito, Katsuhiro ^a   Yaita, Makoto ^a   Kukutsu, Naoya ^a  

^a NTT CORPORATION   (Japan)

Author keywords

300 GHz; Cascode amplifier; Millimeter wave integrated circuit; MMIC; On chip dipole antenna; Silicon lens antenna; Terahertz (THz) communications

Indexed keywords

ANTENNAS; BIT ERROR RATE; DATA COMMUNICATION SYSTEMS; SIGNAL RECEIVERS;

300 GHZ; CASCODE AMPLIFIER; MILLIMETER-WAVE INTEGRATED CIRCUITS; ON-CHIP DIPOLE; TERAHERTZ(THZ) COMMUNICATIONS;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 84897402821     PISSN: 2156342X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TTHZ.2013.2252954     Document Type: Article

References (23)

1. H.-J. Song and T. Nagatsuma, "Present and future of terahertz communications," IEEE Trans. THz Sci. Technol., vol. 1, no. 1, pp. 256-263, Sep. 2011.
2. T. Kürner, "Towards future THz communications systems," Int. J. THz Sci. Technol., vol. 5, no. 1, pp. 11-17, Mar. 2012.
3. ITU, Attenuation by Atmospheric Gases, ITU-R Recommendation, 2009, pp. 676-678.
4. L. Samoska, "An overview of solid state integrated circuit amplifiers in the submillimeter-wave and terahertz regime," IEEE Trans. THz Sci. Technol., vol. 1, no. 1, pp. 9-24, Sep. 2011.
5. W. R.Deal, X. B. Mei, K. Leong, V. Radisic, S. Sarkozy, B. Gorospe, J. Lee, P. H. Liu, W. Yoshida, J. Zhou, M. Lange, and R. Lai, "Terahertz monolithic integrated circuits using InP high electron mobility transistors," IEEE Trans. THz Sci. Technol., vol. 1, no. 1, pp. 25-32, Sep. 2011.
6. M. Urteaga, M. Seo, J. Hacker, Z. Griffith, A. Young, R. Pierson, P. Rowell, A. Skalare, and M. J. W. Rodwell, "InP HBTs for THz frequency integrated circuits," in Proc. 2011 IEEE Indium Phosphide and Related Mater., Berlin, Germany, May 2011.
7. M. Seo, M. Urteaga, J. Hacker, A. Young, Z. Griffith, V. Jain, R. Pierson, P. Rowell, A. Skalare, A. Peralta, R. Lin, D. Pukala, and M. Rodwell, "InP HBT IC technology for terahertz frequencies: Fundamental oscillators up to 0.57 THz," IEEE J. Solid-State Circuits, vol. 46, no. 10, pp. 2203-2214, Oct. 2011.
8. M. Seo,M.Urteaga, M. Rodwell, andM.-J.Choe, "A300GHz PLL in an InP HBT technology," in 2011 IEEE Int.Microw. Symp. Dig. (MTT), Baltimore, MD, Jun.
9. A. Tessmann, H. Massler, U. Lewark, S. Wagner, I. Kallfass, and A. Leuther, "Fully integrated 300 GHz receiver S-MMICs in 50 nm metamorphic HEMT technology," in 2011 IEEE Compound Semicond. Integr. Circuits Symp. (CSICS), Oct. 16-19, 2011, pp. 1-4.
10. M. Abbasi, S. E. Gunnarsson, N.Wadefalk, R. Kozhuharov, J. Svedin, S. Cherednichenko, I. Angelov, I. Kallfass, A. Leuther, and H. Zirath, "Single-Chip 220-GHz active heterodyne receiver and transmitter MMICswith on-chip integrated antenna," IEEE Trans.Microw. Theory Techn., vol. 59, no. 2, pp. 466-478, Feb. 2011.
11. Z. Griffith,M. Urteaga,R.Pierson, P.Rowell,M.Rodwell, andB. Brar, "A 204.8 GHz static divide-by-eight frequency divider in 250 nm InP HBT," in 2010 IEEE Compound Semiconductor IC Symposium Digest, Monterey, CA, Oct. 2010.
12. J.-D. Park, S. Kang, S. V. Thyagarajan, E. Alon, and A. M. Niknejad, "A 260 GHz fully integrated CMOS transceiver for wireless chip-tochip communication," in Proc. Symp. VLSI Circuits, Jun. 2012, pp. 48-49.
13. A. Hirata, R. Yamaguchi, T. Kosugi, H. Takahashi, K. Murata, T. Nagatsuma, N. Kukutsu, Y. Kado, N. Iai, S. Okabe, S. Kimura, H. Ikegawa, H. Nishikawa, T. Nakayama, and T. Inada, "10-Gbit/s wireless link using InP HEMT MMICs for generating 120-GHz-band millimeter-wave signal," IEEE Trans. Microw. Theory Techn., vol. 57, no. 5, pp. 1102-1109, May 2009.
14. A. Hirata, T. Kosugi, H. Takahashi, J. Takeuchi, K. Murata, N. Kukutsu, Y. Kado, S. Okabe, T. Ikeda, F. Suginosita, K. Shogen, H. Nishikawa, A. Irino, T. Nakayama, and N. Sudo, "5.8-km 10-Gbps data transmission over a 120-GHz-band wireless link," in 2010 Int. Conf. on Wireless Inf. Technol. Syst. (ICWITS), 2010, pp. 1-4.
15. J. Takeuchi, A. Hirata, H. Takahashi, and N. Kukutsu, "10-Gbit/s bi-directional and 20-Gbit/s uni-directional data transmission over a 120-GHz-Band wireless link using a finline ortho-mode transducer," in Asia-Pacific Microw. Conf. 2010, Dec. 2010.
16. H.-J. Song, K. Ajito, A. Hirata, A. Wakatsuki, Y. Muramoto, T. Furuta, N. Kukutsu, T. Nagatsuma, and Y. Kado, "8 Gbit/s wireless data transmission at 250 GHz," Electron Lett., vol. 45, pp. 1121-1122, Oct. 2009.
17. H.-J. Song, K. Ajito, Y. Muramoto, A. Wakatsuki, T. Nagatsuma, and N. Kukutsu, "24 Gbit/s data transmission in 300 GHz band for future terahertz communications," Electron. Lett., vol. 48, no. 15, pp. 953-954, Jul. 2012.
18. I. Kallfass, J. Antes, T. Schneider, F. Kurz, D. Lopez-Diaz, S. Diebold, H. Massler, A. Leuther, and A. Tessmann, "All active MMIC-based wireless communication at 220 GHz," IEEE Trans. THz Sci. Technol., vol. 1, no. 2, pp. 477-487, Nov. 2011.
19. K. C. Gupta, R. Gary, I. Bahl, and P. Bhartia, Microstrip Lines and Slotlines, 2nd ed. : Artech House, 1996, ch. 3-4.
20. N. I. Dib, W. P. Harokopus, G. E. Ponchak, and L. P. B. Katehi, "A comprehensive study between shielded and open coplanar waveguide discontinuities," Int. J. Microw. Milli-Wave Comput.-Aided Eng., vol. 2, no. 4, pp. 331-341, 1992. (Pubitemid 23558323)
21. K. Uehara, K. Miyashita, K.-I. Natsume, K. Hatakeyama, and K. Mizuno, "Lens-coupled imaging arrays for the millimeter-and submillimeter-wave regions," IEEE Trans. Microw. Theory Techn., vol. 40, no. 5, pp. 806-811, May 1992.
22. H.-R. Chuang and L.-C.Kuo, "3-D FDTD design analysis of a 2.4-GHz polarization-diversity printed dipole an-tenna with integrated balun and polarization-switching circuit forWLAN and wireless communication applications," IEEE Trans. Microw. Theory Techn., vol. 51, no. 2, pp. 374-381, Feb. 2003.
23. A. Wakatsuki, T. Furuta, Y. Muramoto, T. Yoshimatsu, and H. Ito, "High-power and broadband sub-terahertz wave generation using a J-band photomixer module with rectangular-waveguide output port," in Proc. Int. Conf. Infrared, Millim. THz Waves (IRMMW-THz), 2008.