Copper corrosion mitigation by binary inhibitor compositions of potassium sorbate and benzotriazole

Corrosion Science

Volumn 82, Issue , 2014, Pages 271-279

  Gelman, D ^a   Starosvetsky, D ^a   Ein Eli, Y ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

Copper; Passivity; Polarization; Potentiostatic; SEM; XPS

Indexed keywords

POLARIZATION; SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

BENZOTRIAZOLES; BINARY INHIBITORS; CORROSION MITIGATIONS; PASSIVITY; POTENTIOSTATICS;

COPPER;

EID: 84894830376     PISSN: 0010938X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.corsci.2014.01.028     Document Type: Article

References (47)

1. Shreir L., Jarman R., Burstein G. Corrosion, Metal/Environment Reactions 1994, vol. 1. Butterworth-Heinemann, Oxford, England.
2. Strehblow H.H., Titze B. The investigation of the passive behaviour of copper in weakly acid and alkaline solutions and the examination of the passive film by ESCA and ISS. Electrochim. Acta 1980, 25:839-850.
3. Finšgar M., Milošev I. Inhibition of copper corrosion by 1,2,3-benzotriazole: a review. Corros. Sci. 2010, 52:2737-2749.
4. Murarka S.P., Verner I.V., Gutmann R.J., Murarka S.P. Copper-Fundamental Mechanisms for Microelectronic Applications 2000, John Wiley.
5. Ein-Eli Y., Starosvetsky D. Review on copper chemical-mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI) - an electrochemical perspective. Electrochim. Acta 2007, 52:1825-1838.
6. Burke L., Ahern M., Ryan T. An investigation of the anodic behavior of copper and its anodically produced oxides in aqueous solutions of high pH. J. Electrochem. Soc. 1990, 137:553-561.
7. Boning D.S., Ouma O. Chemical mechanical polishing in silicon processing. Semiconduct. Semimet. 2000, 63:108.
8. Borst C.L., Gill W.N., Gutmann R.J. Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses 2002, Kluwer Academic Publishers, Boston.
9. Ein-Eli Y., Abelev E., Rabkin E., Starosvetsky D. The compatibility of copper CMP slurries with CMP requirements. J. Electrochem. Soc. 2003, 150:C646-C652.
10. Sethuraman A.R., Wang J.F., Cook L.M. Review of planarization and reliability aspects of future interconnect materials. J. Electron. Mater. 1996, 25:1617-1622.
11. Shinn G., Korthuis V., Wilson A., Grover G., Fang S. Chemical-mechanical polish. Handbook Semiconduct. Manuf. Technol. 2000, 415-460.
12. Steigerwald J.M., Murarka S.P., Gutmann R.J. Chemical Mechanical Planarization of Microelectronic Materials 1997, John Wiley & Sons, New York.
13. Stein D.J., Hetherington D.L., Cecchia J.L. Investigation of the kinetics of tungsten chemical mechanical polishing in potassium iodate-based slurries: II. Roles of colloid species and slurry chemistry. J. Electrochem. Soc. 1999, 146:1934.
14. Abelev E., Smith A.J., Hassel A.W., Ein-Eli Y. Reprint of "Potassium sorbate solutions as copper chemical mechanical planarization (CMP) based slurries". Electrochim. Acta 2007, 53:1020-1028.
15. Ein-Eli Y., Abelev E., Starosvetsky D. Electrochemical aspects of copper chemical mechanical planarization (CMP) in peroxide based slurries containing BTA and glycine. Electrochim. Acta 2004, 49:1499-1503.
16. Nagar M., Vaes J., Ein-Eli Y. Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: effects of sorbate on chemical mechanical planarization performance. Electrochim. Acta 2010, 55:2810-2816.
17. Nagar M., Starosvetsky D., Vaes J., Ein-Eli Y. Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurry. Part I. Elucidating slurry chemistry. Electrochim. Acta 2010, 55:3560-3571.
18. Abelev E., Starosvetsky D., Ein-Eli Y. Potassium sorbate-a new aqueous copper corrosion inhibitor: electrochemical and spectroscopic studies. Electrochim. Acta 2007, 52:1975-1982.
19. Ein-Eli Y., Abelev E., Starosvetsky D. Food preservatives serving as nonselective metal and alloy corrosion inhibitors. Electrochem. Solid State Lett. 2006, 9:B5-B7.
20. Wang C., Gao J., Tian J., Niu X., Liu Y. Chemical mechanical planarization of barrier layers by using a weakly alkaline slurry. Microelectron. Eng. 2013.
21. Villamil R.F.V., Corio P., Agostinho S.M.L., Rubim J.C. Effect of sodium dodecylsulfate on copper corrosion in sulfuric acid media in the absence and presence of benzotriazole. J. Electroanal. Chem. 1999, 472:112-119.
22. Qafsaoui W., Blanc C., Pébère N., Takenouti H., Srhiri A., Mankowski G. Quantitative characterization of protective films grown on copper in the presence of different triazole derivative inhibitors. Electrochim. Acta 2002, 47:4339-4346.
23. Brusic V., Frisch M., Eldridge B., Novak F., Kaufman F., Rush B., Frankel G. Copper corrosion with and without inhibitors. J. Electrochem. Soc. 1991, 138:2253-2259.
24. Abdullah A.M., Al-Kharafi F.M., Ateya B.G. Intergranular corrosion of copper in the presence of benzotriazole. Scr. Mater. 2006, 54:1673-1677.
25. Fleischmann M., Hill I., Mengoli G., Musiani M. The synergetic effect of benzylamine on the corrosion inhibition of copper by benzotriazole. Electrochim. Acta 1983, 28:1325-1333.
26. Hao Y.Z., Yang M.Z., Yu C., Cai S.M., Zhou G.D. The effects of chloride ions and benzotriazole on photoresponses of copper electrodes. Thin Solid Films 1999, 347:289-294.
27. Loo B., Ibrahim A., Emerson M. Analysis of surface coverage of benzotriazole and 6-tolyltriazole mixtures on copper electrodes from surface-enhanced Raman spectra. Chem. Phys. Lett. 1998, 287:449-454.
28. Mamaş S., Kiyak T., Kabasakaloǧlu M., Koc A. The effect of benzotriazole on brass corrosion. Mater. Chem. Phys. 2005, 93:41-47.
29. Matos J., D'Elia E., Barcia O., Mattos O., Pébère N., Tribollet B. Rotating disc and hemispherical electrodes for copper dissolution study in hydrochloric solution in the presence of benzotriazole. Electrochim. Acta 2001, 46:1377-1383.
30. Subramanian R., Lakshminarayanan V. Effect of adsorption of some azoles on copper passivation in alkaline medium. Corros. Sci. 2002, 44:535-554.
31. Tromans D., Sun R. Anodic polarization behavior of copper in aqueous chloride/benzotriazole solutions. J. Electrochem. Soc. 1991, 138:3235-3244.
32. Tromans D. Aqueous potential-pH equilibria in copper-benzotriazole systems. J. Electrochem. Soc. 1998, 145:L42-L45.
33. Yu P., Liao D.M., Luo Y.B., Chen Z.G. Studies of benzotriazole and tolytriazole as inhibitors for copper corrosion in deionized water. Corrosion 2003, 59:314-318.
34. Zerbino J. Ellipsometric and photocurrent characterization of oxide films formed on copper in borax solution with and without benzotriazol. Electrochim. Acta 1999, 45:819-825.
35. Zhang D., Gao L., Zhou G. Inhibition of copper corrosion in aerated hydrochloric acid solution by heterocyclic compounds containing a mercapto group. Corros. Sci. 2004, 46:3031-3040.
36. Zhang D., Gao L., Zhou G. Synergistic effect of 2-mercapto benzimidazole and KI on copper corrosion inhibition in aerated sulfuric acid solution. J. Appl. Electrochem. 2003, 33:361-366.
37. Zhou G.D., Shao H., Loo B. A study of the copper electrode behavior in borax buffer solutions containing chloride ions and benzotriazole-type inhibitors by voltammetry and the photocurrent response method. J. Electroanal. Chem. 1997, 421:129-135.
38. Antonijevic M., Petrovic M. Copper corrosion inhibitors. A review. Int. J. Electrochem. Sci. 2008, 3:1-28.
39. 4 solution. Appl. Surf. Sci. 2013.
40. Kim H.C., Kim M.J., Lim T., Park K.J., Kim K.H., Choe S., Kim S., Kim J.J. Effects of nitrogen atoms of benzotriazole and its derivatives on the properties of electrodeposited Cu films. Thin Solid Films 2013.
41. Chen Z., Huang L., Zhang G., Qiu Y., Guo X. Benzotriazole as a volatile corrosion inhibitor during the early stage of copper corrosion under adsorbed thin electrolyte layers. Corros. Sci. 2012, 65:214-222.
42. Mezzi A., Angelini E., De Caro T., Grassini S., Faraldi F., Riccucci C., Ingo G. Investigation of the benzotriazole inhibition mechanism of bronze disease. Surf. Interface Anal. 2012, 44:968-971.
43. Frignani A., Tommesani L., Brunoro G., Monticelli C., Fogagnolo M. Influence of the alkyl chain on the protective effects of 1, 2, 3-benzotriazole towards copper corrosion.: Part I: inhibition of the anodic and cathodic reactions. Corros. Sci. 1999, 41:1205-1215.
44. Platzman I., Brener R., Haick H., Tannenbaum R. Oxidation of polycrystalline copper thin films at ambient conditions. J. Phys. Chem. C 2008, 112:1101-1108.
45. Finšgar M., Kovač J., Milošev I. Surface analysis of 1-hydroxybenzotriazole and benzotriazole adsorbed on Cu by X-ray photoelectron spectroscopy. J. Electrochem. Soc. 2010, 157:C52-C60.
46. Cohen S., Brusic V., Kaufman F., Frankel G., Motakef S., Rush B. X-ray photoelectron spectroscopy and ellipsometry studies of the electrochemically controlled adsorption of benzotriazole on copper surfaces. J. Vacuum Sci. Technol. A: Vacuum Surf. Films 1990, 8:2417-2424.
47. Mansikkamäki K., Haapanen U., Johans C., Kontturi K., Valden M. Adsorption of benzotriazole on the surface of copper alloys studied by SECM and XPS. J. Electrochem. Soc. 2006, 153:B311-B318.