Patterned Ni-P alloy films prepared by "reducing-discharging" process and the hydrophobic property

ACS Applied Materials and Interfaces

Volumn 6, Issue 2, 2014, Pages 1053-1060

  Yu, Quanyao ^a,b   Zeng, Zhixiang ^a   Zhao, Wenjie ^a   Ma, Yongcun ^a   Wu, Xuedong ^a   Xue, Qunji ^a  

^a NINGBO INSTITUTE OF MATERIALS TECHNOLOGY AND ENGINEERING   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

chemical deposition; electrodeposition; hydrophobic; morphology; patterned surface; synergistic effect

Indexed keywords

CHEMICAL DEPOSITION; ELECTROCHEMICAL DEPOSITION; ELECTROCHEMICAL DEPOSITION PROCESS; HYDROPHOBIC; HYDROPHOBIC PROPERTIES; MICRO-NANOSCALE PARTICLES; PATTERNED SURFACE; SYNERGISTIC EFFECT;

ELECTRODEPOSITION; HYDROPHOBICITY; METALLIC FILMS; MORPHOLOGY; NANOPARTICLES; NICKEL; PHOTOELECTRONS; REDUCTION; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

DEPOSITION;

EID: 84892928361     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am404590d     Document Type: Article

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