Effects of temperature and strain rate on the mechanical properties of silicene

Journal of Applied Physics

Volumn 115, Issue 2, 2014, Pages

  Pei, Qing Xiang ^a   Sha, Zhen Dong ^b   Zhang, Ying Yan ^c   Zhang, Yong Wei ^a  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b XI'AN JIAOTONG UNIVERSITY   (China)

^c UNIVERSITY OF WESTERN SYDNEY   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

EFFECTS OF TEMPERATURE AND STRAIN RATE; FRACTURE BEHAVIOR; FRACTURE PROCESS; FRACTURE STRAIN; GRAPHENE LIKES; MOLECULAR DYNAMICS SIMULATIONS; TEMPERATURE DECREASE; UNIAXIAL TENSILE DEFORMATION;

BRITTLE FRACTURE; ELECTRONIC PROPERTIES; FRACTURE MECHANICS; FRACTURE TOUGHNESS; GRAPHENE; MECHANICAL PROPERTIES; MOLECULAR DYNAMICS; SEMICONDUCTING SILICON; SILICON; TEMPERATURE;

STRAIN RATE;

EID: 84892380414     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4861736     Document Type: Article

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