Practical aspects of FIB tem specimen preparation with emphasis on semiconductor applications

Introduction to Focused Ion Beams: Instrumentation, Theory, Techniques and Practice

Volumn , Issue , 2005, Pages 173-200

  Anderson, Ron ^a   Klepeis, Stanley J ^b  

^a Microscopy Today   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

FIB Artifacts; Precise preparation of preselected locations; Rapid preparation; Semiconductor specimens; Specimen preparation spatial resolution; Tripod polishing and FIB

Indexed keywords

EID: 84892302867     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/0-387-23313-X_9     Document Type: Chapter

References (21)

1. Anderson RM and Klepeis SJ "Combined Tripod Polishing and FIB Methods for Preparing Semiconductor Plan View Specimens". Specimen Preparation for Transmission Electron Microscopy of Materials IV, (eds.) R. Anderson, et.al., Materials Research Symposium Series 480, pp 187-192 (1997).
2. Anderson RM, et al., Microscopy of Semiconducting Materials 1989, Proceedings of the Physics Conference held at Oxford University, 10-13 April 1989, ed. by Cullis, A. G. and Hutchison J. L., Institute of Physics Conference Series Number 100, Bristol and New York (1989).
3. Anderson RM, et al., Proceedings EUREM 1996, Steer M. Cottrell D (eds.) p 79-80 (1992).
4. Anderson, RM, "Precision Ion Milling of Layered, Multi-Element TEM Specimens with High Specimen Preparation Spatial Resolution" In Specimen Preparation for Transmission Electron Microscopy of Materials-111, ed. Anderson, et al., Mater. Res. Soc. Proc. 254, Pittsburgh, PA USA pp. 141-148 (1992).
5. Anderson, RM, et a]., Microbeam Analysis-1995, Proceedings of the 29th Annual Meeting of the Microbeam Analysis Society, ed. E. Etz, p. 135 (1995).
6. Basile D, et al. "FIBXTEM - Focussed Ion Beam Milling for TEM Sample preparation." Specimen Preparation for Transmission Electron Microscopy of Materials 111, (ed.) R. Anderson, Materials Research Symposium Series 254, pp 23-41 (1992).
7. Benedict JP, et al., "A Method for Precision Specimen Preparation for Both SEM and TEM Analysis." EMSA Bulletin, 19,2, pp. 74-80 (ovember,1989)
8. Benedict JP, et al., "Recent Advances in E.M. Specimen Preparation: Cross-Section samples." in International Symposium on Electron Microscopy, ed. by Kuo K and Yao J, World Scientific, p. 450-460 (1990a).
9. Benedict JP, et al., " Procedure for Cross Sectioning Specific Semiconductor Devices for both SEM and TEM Analysis." In Specimen Preparation for Transmission Electron Microscopy of Materials-11, ed. Anderson, R., Mater. Res. Soc. Proc. 199, Pittsburgh, PA USA pp. 189-204 (1990b).
10. Benedict, JP, et al. "Recent Developments in the use of the Tripod Polisher for TEM Specimen Preparation." In Specimen Preparation for Transmission Electron Microscopy of Materials-111, ed. Anderson et al., Mater. Res. Soc. Proc. 254, Pittsburgh, PA USA pp. 121-140 (1992).
11. Bravman JC, Sinclair R "The Preparation of Cross-section Specimens for Transmission Electron Microscopy." J Electron Microsc Tech 1:53-61 (1984)
12. Hauffe W 'Thesis B, Technical University of Dresden, Dresden (1978)
13. Hauffe W Proc. 10th National Conference on Electron Microscopy, Phys. Sci. GDR, Leipzig, p. 307-308 (1981)
14. Hauffe W, DDR Patentschrift DD218954 Bl, 29 (September 982)
15. Hauffe W, "Ion Beam Microtome for Preparation of TEM Samples." Proc EUREM 1984, 1, pp 105-106 (1984).
16. Kirk EC et al. "Cross-sectional transmission electron microscopy of precisely selected regions from semiconductor devices." Inst. Phys. Conf. Series, 100, p 501-506 (1989) and numerous other references by many authors in the following years
17. Klepeis SJ, et al., "A GrindingIPolishing Tool for TEM Sample preparation." In Specimen Preparation for Transmission Electron Microscopy of Materials, ed. Bravman, et al.,Mater. Res. Soc. Proc. 115, Pittsburgh, PA USA pp. 179-184 (1987).
18. Klepeis SJ, et al., "A Technique for Preparing Semiconductor Cross Sections for both TEM and SEM Analysis," EMSA Proceedings, ed. by Bailey, G.W., San Francisco Press, p. 712-713 (1988).
19. Klepeis SJ, Proceedings of the 14th International Congress on Electron Microscopy, Vol 111, Electron Microscopy 1998, p 541-542 (1998).
20. Klepeis SJ, et al., "FIB Dimpling: A Method for Preparing Plan-View TEM Specimens," EMSA Proceedings, ed. by Bailey, G.W., Springer-Verlag Presspp. 506-507 (2000).
21. Langford RM and Petford-Long AK "Broad ion beam milling of focused ion beam prepared transmission electron microscopy cross sections for high resolution electron microscopy," J Vac Sci Techno1 A 19(3), p 982-985 (2001).