Optimized thin-film diffusion soldering for power-electronics production

Proceedings of the International Spring Seminar on Electronics Technology

Volumn , Issue , 2013, Pages 11-16

  Syed Khaja, Aarief Hussain ^a   Kaestle, Christopher ^a   Reinhardt, Andreas ^a   Franke, Joerg ^a  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; INTERFACES (MATERIALS); SUBSTRATES; THIN FILM CIRCUITS; TIN;

CHIP SUBSTRATES; DIFFUSION SOLDERING; GROWTH OF INTERMETALLICS; PRODUCTION PROCESS; SUBSTRATE ROUGHNESS; THIN-FILM DIFFUSION; TRANSIENT LIQUID PHASE; VAPOR-PHASE SOLDERING;

SOLDERING;

EID: 84891290805     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2013.6648206     Document Type: Conference Paper

References (9)

1. G. Humpston, D. M. Jacobson, and S. P. S. Sangha, "Diffusion soldering for electronics manufacturing," Endeavour, Vol. 18, No. 2, 1994, pp. 55-60.
2. R.J. Fields, S.R., III., Low, and G.K. Jr., Lucey "Physical and Mechanical Properties of Intermetallic Compounds Commonly Found in Solder Joints," The Metal Science of Joining, Proceedings of TMS Symposium, Cincinnati, USA, 20-24 Oct 1991, pp. 165-173.
3. C.C. Lee, P.J. Wang, and J.S. Kim, "Are Intermetallics in Solder Joints Really Brittle," Proceedings of the 57th Electronic Components and Technology Conference, Reno, USA, 2007, pp.648-652.
4. K. Guth, N. Oeschler, L. Böwer, R. Speckels, G. Strotmann, N. Heuck, S. Krasel, and A: Ciliox, "New assembly and interconnect technologies for power modules," Proceedings of CIPS, Nuremberg, Germany, 2012.
5. K. Guth, D. Siepe, J. Görlich, H. Torwesten, Roth, R.; Hille, and F; Umbach, "New assembly and interconnections beyond sintering methods," Proceedings of the 6th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, 2010.
6. S.C. Richard, "The Complete Solder Paste Printing Processes", SMT, Vol. 13, No. 1 (special supplement: Guide to Soldering &Printing), 1999, pp. 6-8.
7. M-H. Lu and K.-C. Hsieh, "Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness," Journal of Electronic Materials, Vol. 36, No.11, 2007, pp. 1448-1454.
8. X. Deng, G. Piotrowski, J. J. Williams, and N. Chawla, "Influence of Initial Morphology and Thickness of Cu 6Sn 5 and Cu 3Sn Intermetallics on Growth and Evolution during Thermal Aging of Sn-Ag Solder/Cu Joints," J Electron Mater, Vol. 32, No. 12, 2003, pp. 1403-1413.
9. N. S. Bosco and F. W. Zok, "Critical interlayer thickness for transient liquid phase bonding in the Cu-Sn system," Acta Materialia, Vol. 52, No. 10, 2004, pp. 2965-2972.