-
1
-
-
61549134832
-
Nucleation of Sn and Sn-Cu alloys on Pt during electrodeposition from Sn-citrate and Sn-Cu-citrate solutions
-
C. Han, Q. Liu, and D.G. Ivey Nucleation of Sn and Sn-Cu alloys on Pt during electrodeposition from Sn-citrate and Sn-Cu-citrate solutions Electrochim. Acta 54 2009 3419
-
(2009)
Electrochim. Acta
, vol.54
, pp. 3419
-
-
Han, C.1
Liu, Q.2
Ivey, D.G.3
-
2
-
-
28344454324
-
The electrochemical deposition of tin-nickel alloys and the corrosion properties of the coating
-
M.S. Jellesen, and P. Miller The electrochemical deposition of tin-nickel alloys and the corrosion properties of the coating Plat. Surf. Finish. 92 2005 36
-
(2005)
Plat. Surf. Finish.
, vol.92
, pp. 36
-
-
Jellesen, M.S.1
Miller, P.2
-
4
-
-
84864585626
-
High-performance Sn-Ni alloy nanorod electrodes prepared by electrodeposition for lithium ion rechargeable batteries
-
D. Jiang, X. Ma, and Y. Fu High-performance Sn-Ni alloy nanorod electrodes prepared by electrodeposition for lithium ion rechargeable batteries J. Appl. Electrochem. 42 2012 555
-
(2012)
J. Appl. Electrochem.
, vol.42
, pp. 555
-
-
Jiang, D.1
Ma, X.2
Fu, Y.3
-
5
-
-
0031166171
-
Electrochemical and in Situ X-ray diffraction studies of the reaction of lithium with tin oxide composites
-
I.A. Courtney, and J.R. Dahn Electrochemical and in Situ X-ray diffraction studies of the reaction of lithium with tin oxide composites J. Electrochem. Soc. 144 1997 2045
-
(1997)
J. Electrochem. Soc.
, vol.144
, pp. 2045
-
-
Courtney, I.A.1
Dahn, J.R.2
-
6
-
-
23844440970
-
Tin-nickel alloy plating
-
S.K. Jalota Tin-nickel alloy plating Met. Finish. 100 2002 307
-
(2002)
Met. Finish.
, vol.100
, pp. 307
-
-
Jalota, S.K.1
-
7
-
-
33846021222
-
Selective area deposition of Tin-Nickel alloy coating - An alternative for decorative chromium plating
-
B. Subramanian, S. Mohan, and S. Jayakrishnan Selective area deposition of Tin-Nickel alloy coating - an alternative for decorative chromium plating J. Appl. Electrochem. 37 2007 219
-
(2007)
J. Appl. Electrochem.
, vol.37
, pp. 219
-
-
Subramanian, B.1
Mohan, S.2
Jayakrishnan, S.3
-
8
-
-
2942558549
-
Effects of ethoxylated α-naphtholsulfonic acid on tin electroplating at iron electrodes
-
J.-Y. Lee, J.-W. Kim, B.-Y. Chang, H.T. Kim, and S.-M. Parj Effects of ethoxylated α-naphtholsulfonic acid on tin electroplating at iron electrodes J. Electrochem. Soc. 151 2004 C333
-
(2004)
J. Electrochem. Soc.
, vol.151
, pp. 333
-
-
Lee, J.-Y.1
Kim, J.-W.2
Chang, B.-Y.3
Kim, H.T.4
Parj, S.-M.5
-
9
-
-
1642450965
-
Tin electroplating from sulfate electrolyte containing syntanol, formalin, and coumarin
-
G.I. Medvedev, L.A. Nekrasova, and N.A. Makrushin Tin electroplating from sulfate electrolyte containing syntanol, formalin, and coumarin Russ. J. Appl. Chem. 76 2003 387
-
(2003)
Russ. J. Appl. Chem.
, vol.76
, pp. 387
-
-
Medvedev, G.I.1
Nekrasova, L.A.2
Makrushin, N.A.3
-
12
-
-
51849094511
-
Electrochemistry of Sn(II)/Sn in a hydrophobic room-temperature ionic liquid
-
N. Tachikawa, N. Serizawa, Y. Katayama, and T. Miura Electrochemistry of Sn(II)/Sn in a hydrophobic room-temperature ionic liquid Electrochim. Acta 53 2008 6530
-
(2008)
Electrochim. Acta
, vol.53
, pp. 6530
-
-
Tachikawa, N.1
Serizawa, N.2
Katayama, Y.3
Miura, T.4
-
13
-
-
79954609496
-
Electrochemistry of tin in the 1-ethyl-3-methylimidazolium dicyanamide room temperature ionic liquid
-
T.-I. Leong, Y.-T. Hsieh, and I.-W. Sun Electrochemistry of tin in the 1-ethyl-3-methylimidazolium dicyanamide room temperature ionic liquid Electrochim. Acta 56 2011 3941
-
(2011)
Electrochim. Acta
, vol.56
, pp. 3941
-
-
Leong, T.-I.1
Hsieh, Y.-T.2
Sun, I.-W.3
-
14
-
-
84975381177
-
The electrochemistry of tin in the aluminum chloride-1-methyl-3- ethylimidazolium chloride molten salt
-
X.-H. Xu, and C.L. Hussey The electrochemistry of tin in the aluminum chloride-1-methyl-3-ethylimidazolium chloride molten salt J. Electrochem. Soc. 140 1993 618
-
(1993)
J. Electrochem. Soc.
, vol.140
, pp. 618
-
-
Xu, X.-H.1
Hussey, C.L.2
-
16
-
-
33749672463
-
Application of ionic liquids to the electrodeposition of metals
-
A.P. Abbott, and K.J. McKenzie Application of ionic liquids to the electrodeposition of metals Phys. Chem. Chem. Phys 8 2006 4265
-
(2006)
Phys. Chem. Chem. Phys
, vol.8
, pp. 4265
-
-
Abbott, A.P.1
McKenzie, K.J.2
-
17
-
-
33845919349
-
Electrodeposition of zinc-tin alloys from deep eutectic solvents based on choline chloride
-
A.P. Abbott, G. Capper, K.J. McKenzie, and K.S. Ryder Electrodeposition of zinc-tin alloys from deep eutectic solvents based on choline chloride J. Electroanal. Chem. 599 2007 288
-
(2007)
J. Electroanal. Chem.
, vol.599
, pp. 288
-
-
Abbott, A.P.1
Capper, G.2
McKenzie, K.J.3
Ryder, K.S.4
-
18
-
-
84880420042
-
The effect of complex agents on the electrodeposition of tin from deep eutectic solvents
-
N.M. Pereira, C.M. Pereira, and A.F. Silva The effect of complex agents on the electrodeposition of tin from deep eutectic solvents ECS Electrochem. Lett. 1 2012 D5
-
(2012)
ECS Electrochem. Lett.
, vol.1
, pp. 5
-
-
Pereira, N.M.1
Pereira, C.M.2
Silva, A.F.3
-
19
-
-
84864628801
-
Zn-Sn electrodeposition from deep eutectic solvents containing EDTA, HEDTA, and Idranal VII
-
N.M. Pereira, S. Salome, C.M. Pereira, and A.F. Silva Zn-Sn electrodeposition from deep eutectic solvents containing EDTA, HEDTA, and Idranal VII J. Appl. Electrochem. 42 2012 561
-
(2012)
J. Appl. Electrochem.
, vol.42
, pp. 561
-
-
Pereira, N.M.1
Salome, S.2
Pereira, C.M.3
Silva, A.F.4
-
20
-
-
69949171593
-
Studies of cathodic processes during NiSn alloy deposition using choline chloride based ionic liquids
-
A. Cojocaru, S. Costovici, L. Anicai, and T. Visan Studies of cathodic processes during NiSn alloy deposition using choline chloride based ionic liquids Metal. Int. 14 2009 38
-
(2009)
Metal. Int.
, vol.14
, pp. 38
-
-
Cojocaru, A.1
Costovici, S.2
Anicai, L.3
Visan, T.4
-
21
-
-
69949163677
-
Electrochemical investigation of silver/silver ion couple reversibility in choline chloride-urea based ionic liquid
-
L. Anicai, A. Cojocaru, A. Florea, and T. Visan Electrochemical investigation of silver/silver ion couple reversibility in choline chloride-urea based ionic liquid Stud. Univ. Babes-Bolyai Chem. 53 2008 119
-
(2008)
Stud. Univ. Babes-Bolyai Chem.
, vol.53
, pp. 119
-
-
Anicai, L.1
Cojocaru, A.2
Florea, A.3
Visan, T.4
-
22
-
-
79951579698
-
Study of Co-Sn and Ni-Sn alloys prepared in molten chlorides and used as negative electrode in rechargeable lithium battery
-
H. Groulta, H. El Ghallali, A. Barhoun, E. Briot, C.M. Julien, F. Lantelme, and S. Borensztjan Study of Co-Sn and Ni-Sn alloys prepared in molten chlorides and used as negative electrode in rechargeable lithium battery Electrochim. Acta 56 2011 2656
-
(2011)
Electrochim. Acta
, vol.56
, pp. 2656
-
-
Groulta, H.1
El Ghallali, H.2
Barhoun, A.3
Briot, E.4
Julien, C.M.5
Lantelme, F.6
Borensztjan, S.7
-
23
-
-
0019000130
-
Structure of electrodeposited equiatomic tin-nickel alloy
-
C.C. Lo Structure of electrodeposited equiatomic tin-nickel alloy J. Appl. Phys. 51 1980 2007
-
(1980)
J. Appl. Phys.
, vol.51
, pp. 2007
-
-
Lo, C.C.1
-
24
-
-
84890551692
-
-
Casa Cartii de Stiinta Cluj-Napoca
-
E. Grunwald, L. Muresan, G. Vermesan, H. Vermesan, and A. Culic Tratat de Galvanotehnica (Galvanotechnics Treaty - in Romanian) 2005 Casa Cartii de Stiinta Cluj-Napoca 405
-
(2005)
Tratat de Galvanotehnica (Galvanotechnics Treaty - In Romanian)
, pp. 405
-
-
Grunwald, E.1
Muresan, L.2
Vermesan, G.3
Vermesan, H.4
Culic, A.5
-
25
-
-
33644697335
-
Passivation and pitting corrosion of nanostructured Sn-Ni alloy in NaCl solutions
-
S.A.M. Refaey, F. Taha, and T.H.A. Hasanin Passivation and pitting corrosion of nanostructured Sn-Ni alloy in NaCl solutions Electrochim. Acta 51 2006 2942
-
(2006)
Electrochim. Acta
, vol.51
, pp. 2942
-
-
Refaey, S.A.M.1
Taha, F.2
Hasanin, T.H.A.3
-
26
-
-
33646350021
-
Effects of composition and reflowing on the corrosion behavior of Sn-Zn deposits in brine media
-
C.-C. Hu, and C.-K. Wang Effects of composition and reflowing on the corrosion behavior of Sn-Zn deposits in brine media Electrochim. Acta 51 2006 4125
-
(2006)
Electrochim. Acta
, vol.51
, pp. 4125
-
-
Hu, C.-C.1
Wang, C.-K.2
-
27
-
-
80052787570
-
Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn-Cu solder alloy
-
W.R. Osórioa, J.E. Spinelli, C.R.M. Afonso, L.C. Peixoto, and A. Garcia Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn-Cu solder alloy Electrochim. Acta 56 2011 8891
-
(2011)
Electrochim. Acta
, vol.56
, pp. 8891
-
-
Osórioa, W.R.1
Spinelli, J.E.2
Afonso, C.R.M.3
Peixoto, L.C.4
Garcia, A.5
|