Nucleation of Sn and Sn-Cu alloys on Pt during electrodeposition from Sn-citrate and Sn-Cu-citrate solutions

Electrochimica Acta

Volumn 54, Issue 12, 2009, Pages 3419-3427

  Han, Chunfen ^a   Liu, Qi ^a   Ivey, Douglas G ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

Chronoamperometry; Current step method; Electrodeposition; Instantaneous nucleation; Progressive nucleation

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHRONOAMPEROMETRY; COPPER; COPPER DEPOSITS; DIFFUSION; ELECTRODEPOSITION; FORMING; HYDROGEN; NUCLEATION; PLATINUM; PLATINUM ALLOYS; TITANIUM COMPOUNDS;

AFM IMAGES; APPLIED POTENTIALS; ATOMIC-FORCE MICROSCOPIES; CITRATE SOLUTIONS; CU ALLOYS; CU FILMS; CURRENT STEP METHOD; DIFFUSION COEFFICIENTS; DIFFUSION-CONTROLLED PROCESS; ELECTROCHEMICAL TECHNIQUES; HYDROGEN EVOLUTIONS; INITIAL STAGES; INSTANTANEOUS NUCLEATION; POTENTIAL OSCILLATIONS; PROGRESSIVE NUCLEATION; TRANSITION TIME; UNIFORM FILMS;

TIN;

EID: 61549134832     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.12.064     Document Type: Article

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