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Volumn 100, Issue 1 SUPPL., 2002, Pages 307-310
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Tin-nickel alloy plating
a
a
CSL Inc
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
ADDITIVES;
COPPER ALLOYS;
CURRENT DENSITY;
DIFFUSION;
ELECTROPLATING;
FASTENERS;
FILTRATION;
FRICTION;
GEARS;
HARDNESS;
PRINTED CIRCUIT BOARDS;
METASTABLE COMPOUNDS;
TARNISH RESISTANCE;
THROUGH-HOLE PLATING;
TIN-NICKEL ALLOYS;
TIN ALLOYS;
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EID: 23844440970
PISSN: 00260576
EISSN: None
Source Type: Journal
DOI: 10.1016/S0026-0576(02)82034-7 Document Type: Note |
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Times cited : (7)
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References (0)
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