Creation of microstructured surfaces using Cu-Ni composite electrodeposition and their application to superhydrophobic surfaces

Applied Surface Science

Volumn 289, Issue , 2014, Pages 14-20

  Lee, Jae Min ^a   Bae, Kong Myeong ^a   Jung, Kyung Kuk ^a   Jeong, Ji Hwan ^a   Ko, Jong Soo ^a  

^a Pusan National University   (South Korea)

Author keywords

Cu Ni alloy; Cu Ni electrodeposition; Microstructure; Self cleaning; Superhydrophobic

Indexed keywords

ASPECT RATIO; BINARY ALLOYS; COPPER ALLOYS; COPPER COMPOUNDS; ELECTRODEPOSITION; ELECTRODES; HEAVY IONS; HYDROPHOBICITY; MICROSTRUCTURE; NICKEL ALLOYS; SURFACE PROPERTIES;

COMPOSITE ELECTRODEPOSITION; CU -NI ALLOYS; CU ELECTRODEPOSITIONS; MICRO-STRUCTURED SURFACES; NI ELECTRODEPOSITION; SELF CLEANING; SUPER-HYDROPHOBIC SURFACES; SUPERHYDROPHOBIC;

SULFUR COMPOUNDS;

EID: 84890557903     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2013.10.066     Document Type: Article

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