Improvement of thermal and mechanical properties of a phenolic resin nanocomposite by in situ formation of silsesquioxanes from a molecular precursor

Journal of Applied Polymer Science

Volumn 117, Issue 4, 2010, Pages 2272-2277

  SchUtz, Michael R ^a   Sattler, Katrin ^a   Deeken, Stefan ^b   Klein, Otto ^b   Adasch, Volker ^b   Liebscher, Christian H ^a   Glatzel, Uwe ^a   Senker, Jürgen ^a   Breu, Josef ^a  

^a UNIVERSITY OF BAYREUTH   (Germany)

^b DRONCO AG   (Germany)

Author keywords

Mechanical properties; Nanocomposites; NMR; POSS; Thermal properties

Indexed keywords

DECOMPOSITION TEMPERATURE; HEAT FLOWS; IN-SITU; IN-SITU FORMATIONS; MOLECULAR PRECURSOR; NMR; ONSET TEMPERATURE; PHENOLIC RESIN NANOCOMPOSITES; SILANE PRECURSOR; SILSESQUIOXANES; SOLID STATE NMR; STRAIN AT BREAK; THERMAL AND MECHANICAL PROPERTIES; THERMAL PROPERTIES; THERMAL STABILITY; THREE-POINT BENDING TEST; TRIETHOXYSILYL;

BENDING STRENGTH; BENDING TESTS; NANOCOMPOSITES; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; PHENOLIC RESINS; PHENOLS; PLASTICS; RESINS; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS;

MECHANICAL PROPERTIES;

BENDING; BREAKING STRENGTH; DECOMPOSITION; HEAT TREATMENT; NANOCOMPOSITE; PRECURSOR; RESIN; THERMAL STABILITY;

EID: 77952255147     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.32004     Document Type: Article

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