Electromagnetic Compatibility Engineering

Electromagnetic Compatibility Engineering

Volumn , Issue , 2009, Pages 1-843

  Ott, Henry W ^a  

^a Henry Ott Consultants   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84889357967     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9780470508510     Document Type: Book

References (295)

1. 2004/108/EEC. Council Directive 2004/108/EEC Relating to Electromagnetic Compatibility and Repealing Directive 89/336/EEC, Official Journal of the European Union, No. L 390 December 31, 2004, pp. 24-37.
2. ANSI C63.4-1992. Methods of Measurement of Radio-Noise Emissions from Low-Voltage Electrical and Electronic Equipment in the Range of 9 kHz to 40 GHz, IEEE, July 17, 1992.
3. CAN/CSA-CEI/IEC CISPR 22:02. Limits an Methods of Measurement of Radio Disturbance Characteristics of Information Technology Equipment, Canadian Standards Association, 2002.
4. CISPR, Publication 22. "Limits and Methods of Measurement of Radio Interference Characteristics of Information Technology Equipment," 1997.
5. Code of Federal Regulations, Title 47, Telecommunications (47CFR). Parts 1, 2, 15, 18, and 68, U.S. Government Printing Office, Washington, DC.
6. EMCAB-1, Issue 2. Electromagnetic Compatibility Bulletin, "Immunity of Electrical/Electronic Equipment Intended to Operate in the Canadian Radio Environment (0.014-10,000 MHz)." Government of Canada, Department of Communications, August 1, 1982.
7. EN 61000-3-2. Electromagnetic Compatibility (EMC)-Part 3-2: Limits-Limits for Harmonic Current Emissions (Equipment Input Current r 16 A Per Phase), CENELEC, 2006.
8. EN 61000-3-3. Electromagnetic Compatibility (EMC)-Part 3-3: Limits-Limitation of Voltage Changes, Voltage Fluctuations and Flicker in Public Low-Voltage Supply Systems, for Equipment with Rated Current r 16 A Per Phase and Not Subject to Conditional Connection, CENELEC, 2006.
9. European Commission. Guidelines on the Application of Council Directive 89/336/EEC on the Approximation of the Laws of the Member States Relating to Electromagnetic Compatibility, European Commission, 1997.
10. FCC. "Commission Cautions Against Changes in Verified Computing Equipment." Public Notice No. 3281, April 7, 1982.
11. FCC. "United States and Canada Agree on Acceptance of Measurement Reports for Equipment Authorization," Public Notice No. 54795, July 12, 1995.
12. FDA. Guide to Inspections of Electromagnetic Compatibility Aspects of Medical Device Quality Systems, US Food and Drug Administration, Available at http://www.fda. gov/ora/inspect_ref/igs/elec_med_dev/emc1.html. Accessed September 2008.
13. GR-1089-CORE. Electromagnetic Compatibility and Electrical Safety-Generic Criteria for Network Telecommunications Equipment, Telcordia, November 2002.
14. Heirman, D. N. "Broadcast Electromagnetic Environment Near Telephone Equipment." IEEE National Telecommunications Conference, 1976.
15. Janes, D. E. et al. "Nonionizing Radiation Exposure in Urban Areas of the United States." Proceedings of the 5th International Radiation Protection Association. April 1977.
16. MDS-201-0004. Electromagnetic Compatibility Standards for Medical Devices, U.S. Department of Health Education and Welfare, Food and Drug Administration, October 1, 1979.
17. MIL-STD-461E. Requirements For The Control of Electromagnetic Interference Characteristics of Subsystems and Equipment, August 20, 1999.
18. MIL-STD-889B. Dissimilar Metals, Notice 3, May 1993.
19. RTCA/DO-160E. Environmental Conditions and Test Procedures for Airborne Equipment, Radio Technical Commission for Aeronautics (RTCA), December 7, 2004.
20. SAE J551. Performance Levels and Methods of Measurement of Electromagnetic Compatibility of Vehicles and Devices (60 Hz to 18 GHz), Society of Automotive Engineers, June 1996.
21. SAE J1113. Electromagnetic Compatibility Measurement Procedure for Vehicle Components (Except Aircraft) (60 Hz to 18 GHz), Society of Automotive Engineers, July 1995.
22. TIA-968-A. Telecommunications Telephone Terminal Equipment Technical Requirements for Connection of Terminal Equipment to the Telephone Network, Telecommunications Industry Association, October 1, 2002.
23. Cohen, T. J., and McCoy, L. G. "RFI-A New Look at an Old Problem." QST, March 1975.
24. Gruber, M. ed. The ARRL RFI Book, Newington, CT, American Radio Relay League, 2007.
25. Marshman, C. The Guide to the EMC Directive 89/336/EEC, IEEE Press, New York, 1992.
26. Wall, A. " Historical Perspective of the FCC Rules For Digital Devices and a Look to the Future," 2004 IEEE International Symposium on Electromagnetic Compatibility, August 9-13, 2004.
27. AES28-2005, AES Standard on Interconnections-Grounding and EMC Practices-Shields of Connectors in Audio Equipment Containing Active Circuitry, Audio Engineering Society, 2005.
28. ANSI/TIA/EIA-568-B.2.1, Commercial Building Telecommunications Cabling Standard-Part 2: Balanced Twisted Pair Components-Addendum I-Transmission Performance Specifications for 4-Pair 100 Ohm Category 6 Cabling, 2002.
29. Brown, J. and Whitlock, B. "Common-Mode to Differential-Mode Conversion in Shielded Twisted-Pair Cables (Shield Current Induced Noise)." Audio Engineering Society 114th Convention, Amsterdam, The Netherlands, 2003.
30. Grover, F. W. "Inductance Calculations-Working Formulas and Tables." Instrument Society of America, 1973.
31. Hayt, W. H., Jr. Engineering Electromagnetics. 3rd ed. McGraw-Hill, New York, 1974.
32. ITT. Reference Data for Radio Engineers. 5th ed. Howard W. Sams & Co., New York, 1968.
33. Muncy, N. "Noise Susceptibility in Analog and Digital Signal Processing Systems." Journal of the Audio Engineering Society, June 1995.
34. Palmgren, C. "Shielded Flat Cables for EMI & ESD Reduction," IEEE Symposium on EMC, Boulder, Co, 1981.
35. Paul, C. R. "Prediction of Crosstalk Involving Twisted Pairs of Wires-Part I: A Transmission-Line Model for Twisted-Wire Pairs," IEEE Transactions on EMC, May 1979.
36. Paul, C. R. "Prediction of Crosstalk Involving Twisted Pairs of Wires-Part II: A Simplified Low-Frequency Prediction Model." IEEE Transactions on EMC, May 1979.
37. Paul, C. R. "Effect of Pigtails on Crosstalk to Braided-Shield Cables." IEEE Transactions on EMC, August 1980.
38. Paul, C. R. "Modelling and Prediction of Ground Shift on Printed Circuit Boards." 1986 IERE Symposium on EMC. York, England, October 1986.
39. Ruehli, A. E. "Inductance Calculations in a Complex Integrated Circuit Environment." IBM Journal of Research and Development, September 1972.
40. Schelkunoff, S. A. "The Electromagnetic Theory of Coaxial Transmission Lines and Cylindrical Shields." Bell System Technical Journal, Vol. 13, October 1934, pp. 532-579.
41. Smith, A. A Coupling of External Electromagnetic Fields to Transmission Lines. Wiley, New York, 1977.
42. Smythe, W. R. Static and Dynamic Electricity. McGraw-Hill, New York, 1924.
43. Tsaliovich, A. Cable Shielding for Electromagnetic Compatibility. New York, Van Nostrand Reinhold, 1995.
44. Vance, E. F. Coupling to Shielded Cables. Wiley, New York, 1978.
45. Buchman, A. S. "Noise Control in Low Level Data Systems." Electromechanical Design, September 1962.
46. Cathy, W., and Keith, R. "Coupling Reduction in Twisted Wires." IEEE International Symposium on EMC, Boulder, August 1981.
47. Ficchi, R. O. Electrical Interference. Hayden Book Co., New York, 1964.
48. Ficchi, R. O. Practical Design For Electromagnetic Compatibility. Hayden Book Co., New York, 1971.
49. Frederick Research Corp, Handbook on Radio Frequency Interference. Vol. 3 (Methods of Electromagnetic Interference Suppression). Frederick Research Corp., Wheaton, MD, 1962.
50. Hilberg. W. Electrical Characteristics of Transmission Lines. Artech House, 1979.
51. Lacoste, R., "Cable Shielding Experiments," Circuit Cellar October, 2008.
52. Mohr, R. J. "Coupling between Open and Shielded Wire Lines over a Ground Plane," IEEE Transactions on EMC, September 1976.
53. Morrison, R. Grounding and Shielding. Wiley, 2007.
54. Nalle, D. "Elimination of Noise in Low Level Circuits." ISA Journal, vol. 12, August 1965.
55. Ott, H. W. Balanced vs. Unbalanced Audio System Interconnections, Available at www.hottconsultants.com/tips.html. Accessed December 2008.
56. Paul, C. R. "Solution of the Transmission-Line Equations for Three-Conductor Lines in Homogeneous Media." IEEE Transactions on EMC, February 1978.
57. Paul, C. R. "Prediction of Crosstalk in Ribbon Cables: Comparison of Model Predictions and Experimental Results." IEEE Transactions on EMC, August 1978.
58. Paul, C. R. Introduction to Electromagnetic Compatibility, 2nd ed. Chapter 9 (Crosstalk) New York Wiley, 2006.
59. Rane Note 110. Sound System Interconnection. Rane Corporation, 1995.
60. Timmons, F. "Wire or Cable Has Many Faces, Part 2." EDN, March 1970.
61. Trompeter, E. "Cleaning Up Signals with Coax." Electronic Products Magazine, July 16, 1973.
62. Denny, H. W. Grounding For the Control of EMI. Gainsville, VA, Don White Consultants, 1983.
63. IEEE Std. 1100-2005, IEEE Recommended Practices for Powering and Grounding Electronic Equipment (The Emerald Book).
64. Lewis, W. H. Handbook of Electromagnetic Compatibility, (Chapter 8, Grounding and Bonding), Perez, R. ed., New York, Academic Press, 1995.
65. NEC 2008, NFPA 70: National Electric Code. National Fire Protection Association (NFPA), Quincy, MA, 2008. (This code is revised every three years.)
66. Ott, H. W. "Ground-A Path for Current Flow." 1997 IEEE International Symposium on EMC. San Diego, CA, October 9-11, 1979.
67. International Association of Electrical Inspectors. SOARES Book on Grounding and Bonding, 10th ed., Appendix A (The History and Mystery of Grounding, 2008). Available at http://www.iaei.org/products/pdfs/historyground.pdf. Accessed September 22, 2008.
68. Terrell, D. L. and Keenan, R. K. Digital Design for Interference Specifications, 2nd ed., Pinellas Park, FL, The Keenan Corporation, 1983.
69. Waaben, S. "High-Performance Optocoupler Circuits," International Solid State Circuits Conference, Philadelphia, PA, February 1975.
70. Brown, H. "Don't Leave System Grounding to Chance." EDN/EEE, January 15, 1972.
71. Cushman, R. H. "Designers Guide to Optical Couplers." EDN, July 20, 1973.
72. DeDad, J. "The Pros and Cons of IG Wiring." EC&M, November 2007. Integrating Electronic Equipment and Power Into Rack Enclosures, Middle Atlantic Products, 2008.
73. Morrison, R. Grounding and Shielding, 5th ed., New York, Wiley, 2007.
74. Morrison, R. and Lewis, W. H. Grounding and Shielding in Facilities, New York, Wiley, 1990. The Truth-Power Distribution & Grounding in Residential AV Installations. Parts 1 to 3
75. Middle Atlantic Products, 2008. Available at http://exactpower.com. Accessed February 2009.
76. Chessman, M. and Sokol, N. "Prevent Emitter Follower Oscillation." Electronic Design, June 21, 1976.
77. Franco, S. "Simple Techniques Provide Compensation for Capacitive Loads." EDN, June 8, 1989.
78. Frederiksen, T. M. Intuitive Operational Amplifiers. New York, McGraw Hill, 1988.
79. Graeme, J. G., Tobey, G. E., and Huelsman, L. P. Operational Amplifiers. New York, McGraw Hill, 1971.
80. Joyce M. V. and Clarke, K. K. Transistor Circuit Analysis, Reading, MA, Addison-Wesley, 1961.
81. Panter, P. F. Modulation, Noise, and Spectral Analysis, New York, McGraw Hill 1965.
82. Schwartz, M. Information Transmission, Modulation and Noise, 2nd ed. New York, McGraw Hill, 1970.
83. Schwartz, M., Bennett, W. R., and Stein, S. Communications Systems and Techniques, New York, McGraw Hill, 1966.
84. Feucht, D. L. Why Circuits Oscillate Spuriously. Part 1: BJT Circuits, Available at http://www.analogzone.com/col_1017.pdf. Accessed April 2009.
85. Feucht, D. L. Why Circuits Oscillate Spuriously. Part 2: Amplifiers, Available at http://www.analogzone.com/col_1121.pdf. Accessed April 2009.
86. Nalle, D. "Elimination of Noise in Low Level Circuits." ISA Journal, Vol. 12, August 1965.
87. Siegel, B. L. "Simple Techniques Help You Conquer Op-Amp Instability." EDN, March 31, 1988.
88. Bogatin, E. Signal Integrin-Simplified. Upper Saddle River, NJ, Prentice Hall, 2004.
89. Campbell, R. H. Jr. and Chipman, R. A. "Noise From Current-Carrying Resistors, 25-500 kHz," Proceedings of the IRE, vol. 37, August 1949, pp. 938-942.
90. Danker, B. "New Methods to Decrease Radiation from Printed Circuit Boards," 6th Symposium on Electromagnetic Compatibility, Zurich, Switzerland, March 5-7, 1985.
91. Fair-Rite Products Corp. Fair-Rite Products Catalog, 15th ed. Wallkill, NY, 2005.
92. Hall, S. H. Hall, G. W. and McCall, J. A. High-Speed Digital System Design. New York, Wiley, 2000.
93. IPC-D-317A, Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques. Northbrook, IL, IPC, 1995.
94. Johnson, H. W. and Graham, M. High-Speed Digital Design. Englewood, NJ, Prentice Hall 1993.
95. Jordan. E. C., ed. Reference Data for Engineers: Radio, Electronics, Computer, and Communications, 7th ed. Indianapolis, IN, Howard W. Sams, 1985, p. 6-7.
96. Skilling, H. H. Electric Transmission Lines. New York, McGraw Hill, 1951.
97. Whalen, J. J. and Paludi, C. "Computer Aided Analysis of Electronic Circuits-the Need to Include Parasitic Elements." International Journal of Electronics, vol. 43, no. 5, November 1977.
98. Henney, K. and Walsh, C. Electronic Components Handbook, Vol. 1. New York, McGraw-Hill, 1957.
99. Rostek, P. M. "Avoid Wiring-Inductance Problems." Electronic Design, vol. 22, December 6, 1974.
100. Archambeault, B. and Thibeau, R. "Effects of Corrosion on the Electrical Properties of Conducted Finishes for EMI Shielding," IEEE National Symposium on Electromagnetic Compatibility, Denver, CO, 1989.
101. ARP 1481. Corrosion Control and Electrical Conductivity in Enclosure Design, Society of Automotive Engineers, May 1978.
102. ARP 1705. Coaxial Test Procedure to Measure the RF Shielding Characteristics of EMI Gasket Materials, Society of Automotive Engineers, 1994.
103. ASTM Standard B 449. Standard Specifications for Chromates on Aluminum, April 1994.
104. Faught, A. N. "An Introduction to Shield Joint Evaluation Using EMI Gasket Transfer Impedance Data," IEEE International Symposium on EMC, August 1982, pp. 38-44.
105. Hayt, W. H. Jr. Engineering Electromagnetics, 3rd. ed. New York, McGraw Hill, 1974.
106. IEC 60950-1, Information Technology Equipment-Safety-Part 1: General Requirements, International Electrotechnical Commission, 2006.
107. Kraus, J. D., and Marhefka, R. J. Antennas. 3rd ed., New York, McGraw-Hill, 2002.
108. MIL-HDBK-1250, Handbook For Corrosion Prevention and Deterioration Control in Electronic Components and Assemblies, August 1995.
109. MIL-STD-C-5541E, Chemical Conversion Coatings on Aluminum and Aluminum Alloys, November 1990.
110. Quine, J. P. "Theoretical Formulas for Calculating the Shielding Effectiveness of Perforated Sheets and Wire Mesh Screens," Proceedings of the Third Conference on Radio Interference Reduction, Armour Research Foundation, February, 1957, pp. 315-329.
111. Schelkunoff, S. A. "The Electromagnetic Theory of Coaxial Transmission Lines and Cylindrical Shields," Bell Sys Tech J, Vol.13, October 1934. pp. 532-579.
112. Schelkunoff, S. A. Electromagnetic Waves. Van Nostrand, New York, 1943.
113. White, R. J. A Handbook of Electromagnetic Shielding Materials and Performance, Don White Consultants, Germantown, M.D., 1975.
114. Carter, D. "RFI Shielding Windows," Tecknit Europe, May 2003, Available at www.tecknit.co.uk/catalog/windowsguide.pdf. Accesed July 2008.
115. Cowdell, R. B. "Nomographs Simplify Calculations of Magnetic Shielding Effectiveness," EDN, vol. 17, September 1, 1972. Available at www.lustrecal.com/enginfo.html. Accessed July 2008.
116. Cowdell, R. B. Nomograms Solve Tough Problems of Shielding," EDN, April 17, 1967. Available at www.lustrecal.com/enginfo.html. Accessed July 2008.
117. Chomerics. EMI Shielding Engineering Handbook. Woburn, MA, 2000.
118. IEEE Transactions on Electromagnetic Compatibility, Special Issue on Electromagnetic Shielding, vol 30-3, August 1988.
119. Kimmel, W. D. and Gerke, D. D. "Choosing the Right Conductive Coating," Conformity, August, 2006.
120. Miller, D. A. and Bridges, J. E. "Review of Circuit Approach to Calculate Shielding Effectiveness," IEEE Transactions on Electromagnetic Compatibility, vol. EMC-10, March 1968.
121. Molyneux-Child, J. W. EMC Shielding Materials, A Designers Guide, Butterworth-Heinemann, London, U.K. 1997.
122. Paul, C. R. Introduction to Electromagnetic Compatibility, Chapter 11, Shielding, 2nd ed., Wiley, New York, 2006.
123. Schultz, R. B. Plantz, V. C. and Bush, D. R. "Shielding Theory and Practice," IEEE Transactions on Electromagnetic Compatibility, vol. 30-3, August 1988.
124. Schultz, R. B. Handbook of Electromagnetic Compatibility, (Chapter 9, Electromagnetic Shielding), Perez, R., ed., New York, Academic Press, 1995.
125. Vitek, C. "Predicting the Shielding Effectiveness of Rectangular Apertures," IEEE National Symposium on Electromagnetic Compatibility, 1989.
126. White, R. J. and Mardiguian, M. Electromagnetic Shielding, Interference Control Technologies, Gainesville, V.A., 1988.
127. Young, F. J. "Ferromagnetic Shielding Related to the Physical Properties of Iron," IEEE Electromagnetic Compatibility Symposium Record, IEEE, New York, 1968.
128. Relay and Switch Industry Association (RSIA), Engineers' Relay Handbook. 6th ed. Arlindton, V.A. 2006.
129. Auger, R. W. and Puerschner, K. The Relay Guide, New York, Reinhold, 1960.
130. Bell Laboratories. Physical Design of Electronic Systems. Vol. 3: Integrated Device and Connection Technology, Chapter 9 (Performance Principles of Switching Contacts), Englewood Cliffs, N.J, Prentice-Hall, 1971.
131. Dewey, R. "Everyone Knows that Inductive Loads Can Greatly Shorten Contact Life." EDN, April 5, 1973.
132. Duell, J. P. Jr. "Get Better Price/Performance from Electrical Contacts." EDN, June 5, 1973.
133. Holm, R. Electrical Contacts. 4th ed. Berlin, Germany, Springer-Verlag, 1967.
134. Howell, K. E. "How Switches Produce Electrical Noise." IEEE Transactions on Electromagnetic Compatibility, vol. EMC-21, No. 3, August, 1979.
135. Oliver, F. J. Practical Relay Circuits. New York, Hayden Book Co., 1971.
136. Penning, F. M. Electrical Discharge in Gases. NewYork, Phillips Technical Library, 1957.
137. Johnson, J. B. "Thermal Agitation of Electricity in Conductors." Physical Review, vol. 32, July 1928, pp. 97-109.
138. Nyquist, H. "Thermal Agitation of Electric Charge in Conductors." Physical Review, vol. 32, July 1928, pp. 110-113.
139. van der Ziel, A. Noise. Englewood Cliffs, N.J. Prentice-Hall, 1954.
140. Baxandall, P. J. "Noise in Transistor Circuits, Part 1." Wireless World, vol. 74, November 1968.
141. Bennett, W. R. "Characteristics and Origins of Noise-Part I." Electronics, vol. 29, March 1956, pp. 154-160.
142. Campbell, R. H., Jr. and Chipman, R. A. "Noise from Current-Carrying Resistors 20 to 500 Kc." Proceedings of I.R. E., vol. 37, August 1949, pp. 938-942.
143. Dummer, G. W. A. Fixed Resistors. London, U.K. Sir Isaac Pitman, 1956
144. Lathi, B. P. Signals, Systems and Communications. Chapter 13. New York, Wiley, 1965.
145. Mumford, W. W. and Scheibe, E. H. Noise Performance Factors in Communication Systems. Horizon House, Dedham, MA, 1969.
146. van der Ziel, A. Fluctuation Phenomena in Semi-Conductors. New York, Academic, 1959.
147. Friis, H. T. "Noise Figures of Radio Receivers." Proceedings of the IRE, Vol. 32, July 1944.
148. Mumford, W. W. and Scheibe, E. H. Noise Performance Factors in Communication Systems. Horizon House, Dedham, MA, 1968.
149. Nielsen, E. G. "Behavior of Noise Figure in Junction Transistors." Proceedings of the IRE, vol. 45, July 1957, pp. 957-963.
150. Rothe, H. and Dahlke, W. "Theory of Noisy Fourpoles." Proceedings of IRE, vol. 44, June 1956."
151. Baxandall, P. J. "Noise in Transistor Circuits." Wireless World, Vol. 74, November-December 1968.
152. Cooke, H. F. "Transistor Noise Figure." Solid State Design, February 1963, pp. 37-42.
153. Gfeller, J. "FET Noise." EEE, June 1965, pp. 60-63.
154. Graeme, J. "Don't Minimize Noise Figure." Electronic Design, January 21, 1971.
155. Haus, H. A., et al. "Representation of Noise in Linear Twoports." Proceedings of IRE, vol. 48, January 1960.
156. Letzter, S. and Webster, N. "Noise in Amplifiers." IEEE Spectrum, vol. 7, no. 8, August 1970, pp. 67-75.
157. Motchenbacher, C. D. and Connelly, J. A., Low Noise Electronic System Design. New York, Wiley, 1993.
158. Robe, T. "Taming Noise in IC Op-Amps." Electronic Design, vol. 22, July 19, 1974.
159. Robinson, F. N. H. "Noise in Transistors." Wireless World, July 1970.
160. Schiek, B., Rolfes, I., and Siwevis, H. Noise in High-Frequency Circuits and Oscillators, New York, Wiley, 2006.
161. Trinogga, L. A. and Oxford, D. F. "J.F.E.T. Noise Figure Measurement." Electronic Engineering, April 1974.
162. van der Ziel, A. "Noise in Solid State Devices and Lasers." Proceedings of the IEEE, vol. 58, August 1970.
163. van der Ziel, A. Noise in Measurements. New York, Wiley, 1976.
164. Watson, F. B. "Find the Quietest JFETs." Electronic Design, November 8, 1974.
165. Barna, A. High Speed Pulse and Digital Techniques. New York Wiley, 1980.
166. Blakeslee, T. R. Digital Design with Standard MSI and LSI, 2nd ed. New York, Wiley, 1979.
167. German, R. F. Use of a Ground Grid to Reduce Printed Circuit Board Radiation. 6th Symposium and Technical Exhibition on Electromagnetic Compatibility, Zurich, Switzerland, March 5-7, 1985.
168. Holloway, C. L. Expression for Conductor Loss of Strip-Line and Coplanar-Strip (CPS) Structures. Microwave and Optical Technology Letters, May 5, 2000.
169. Holloway, C. L. and Hufford, G. A. Internal Inductance and Conductor Loss Associated with the Ground Plane of a Microstrip Line. IEEE Transactions on Electromagnetic Compatibility, May 1997.
170. Holloway, C. L. and Kuester, E. F. Closed-Form Expressions for the Current Density on the Ground Plane of a Microstrip Line, with Applications to Ground Plane Loss. IEEE Transactions on Microwave Theory and Techniques, vol. 43, no. 5, May 1995.
171. Holloway, C. L. and Kuester, E. F. Net Partial Inductance of a Microstrip Ground Plane. IEEE Transactions on Electromagnetic Compatibility, February 1998.
172. Holloway, C. L. and Kuester, E. F. Closed-Form Expressions for the Current Densities on the Ground Plane of Asymmetric Stripline Structures. IEEE Transactions on Electromagnetic Compatibility, February 2007.
173. Johnson, H.W. and Graham, M. High-Speed Signal Propagation, Advanced BlackMagic, Upper Saddle River, NJ, Prentice Hall, 2003.
174. Leferink, F. B. J. and van Doorn, M. J. C. M. Inductance of Printed Circuit Board Ground Planes. IEEE International Symposium on Electromagnetic Compatibility, 1993.
175. Ott, H. W. Ground-A Path for Current Flow. IEEE International Symposium on Electromagnetic Compatibility, 1979.
176. Paul, C. R. Introduction to Electromagnetic Compatibility, 2nd ed. (Chapter 3, Signal Spectra-the Relationship between the Time Domain and the Frequency Domain). New York, Wiley, 2006.
177. Smith, T. S. and Paul, C. R. "Effect of Grid Spacing on the Inductance of Ground Grids," 1991 IEEE International Symposium on Electromagnetic Compatibility, Cherry Hill, NJ, August 1991.
178. Grover, F. W. Inductance Calculations, Working Formulas and Tables. Research Triangle Park, NC, Instrument Society of America, 1973.
179. Mohr, R. J. "Coupling Between Open and Shielded Wire Lines Over a Ground Plane," IEEE Transactions on Electromagnetic Compatibility, September 1967.
180. Archambeault, B. "Eliminating the MYTHS About Printed Circuit Board Power/Ground Plane Decoupling." ITEM, 2001.
181. Archambeault, B. PCB Design for Real-World EMI Control. Boston, MA, Kluwer Academic Publishers, 2002.
182. Howard, J. R. and Lucas, G. L., Inventors; Zycon Corp., assignee. Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture. U.S. patent 5,079,069, January 7, 1992.
183. Janssen, L. P. "Reducing The Emission of Multi-Layer PCBs by Removing the Supply Plane." 1999 Zurich EMC Symposium, Zurich, Switzerland, 1999.
184. Jordan, E. C. Reference Data For Engineers. Indianapolis, IN, Howard W. Sams, 1985.
185. Leferink, F. B. J. and van Etten, W. C. "Reduction of Radiated Electromagnetic Fields by Removing Power Planes." 2004 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, August 9-13, 2004.
186. Paul, Clayton R. "Effectiveness of Multiple Decoupling Capacitors." IEEE Transactions on Electromagnetic Compatibility, May 1992.
187. Radu, S. , DuBroff, R. E. , Hubing, T. H., and Van Doren, T. P. "Designing Power Bus Decoupling for CMOS Devices." 1998 IEEE EMC Symposium Record, Denver, CO, August 1998.
188. Sisler, J., inventor; Unisys Corp., assignee, Method of making multilayer printed circuit board, U.S. patent 5,010,641, April 30, 1991.
189. Sisler, J. "Eliminating Capacitors From Multilayer PCBs." Printed Circuit Design, July 1991.
190. Hubing, T. H., et al. "Power-Bus Decoupling With Embedded Capacitance in Printed Circuit Board Design." IEEE Transactions on Electromagnetic Compatibility, February, 2003.
191. Wang, T. "Characteristics of Buried Capacitancet." EMC Test and Design, February 1993.
192. Balanis, C. A. Antenna Theory, Analysis and Design, New York, Harper & Row 1982.
193. Catt, I. "Crosstalk (Noise) in Digital Systems." IEEE Transactions on Electronic Computers, December 1967.
194. Hardin, K. B. inventor; Lexmark International Inc., assignee. Spread Spectrum Clock Generator. U.S. patent 5,631,920. May 20, 1997.
195. Hoekstra, C. D. "Frequency Modulation of System Clocks for EMI Reduction," Hewlett-Packard Journal, August 1997.
196. Johnson, H. W. and Graham, M. High-Speed Digital Design, Englewood Cliffs, NJ, Prentice Hall, NJ, 1993.
197. Jordan, E. C. Reference Data For Engineers. Indianapolis, IN, Howard W. Sams, 1985.
198. Kraus, J. D. and Marhefka, R. J. Antennas, 3rd ed. New York, McGraw Hill, 2002.
199. Paul, C. R. "Printed Circuit Board EMC." 6th Symposium on EMC, Zurich, Switzerland, March 5-7, 1985.
200. Stutzman, W. L. and Thiel, G. A. Antenna Theory and Design, New York, Wiley, 1981.
201. Gardiner, S. et al. "An Introduction to Spread Spectrum Clock Generation for EMI Reduction." Printed Circuit Design, January 1999.
202. Hardin, K. B., Fessler, J. T., and Bush, D. R. "Spread Spectrum Clock Generators for Reduction of Radiated Emission." 1994 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, August 1994.
203. Mardiguian, M. Controlling Radiated Emission by Design, 2nd ed. Boston, MA, Kluwer Academic Publishers, 2001.
204. Nakauchi, E. and Brasher, L. "Techniques for Controlling Radiated Emission Due to Common-Mode Noise in Electronic Data Processing Systems." IEEE International Symposium on Electromagnetic Compatibility, September 1982.
205. Ott, H. W. "Controlling EMI by Proper Printed Wiring Board Layout." 6th Symposium on EMC, Zurich, Switzerland, March 5-7, 1985.
206. Grasso, C. and Downing, B. "Low-Cost Conducted Emissions Filtering in Switched-Mode Power Supplies." Compliance Engineering, 2006 Annual Reference Guide.
207. Hnatek, E. R. Design of Solid State Power Supplies, 3rd ed. New York, Van Nostrand Reinhold, 1989.
208. Nave, M. J. Power Line Filter Design for Switched-Mode Power Supplies. New York, Van Nostrand Reinhold, 1991.
209. Nicholson, J. R. and Malack, J. A. "RF Impedance of Power Lines and Line Impedance Stabilization Networks in Conducted Interference Measurements." IEEE Transactions on Electromagnetic Compatibility, May 1973.
210. Paul, C. R. Introduction to Electromagnetic Compatibility, 2nd ed. New York, Wiley, 2006.
211. EN 61000-3-2. Electromagnetic Compatibility (EMC)-Part 3-2: Limits-Limits for harmonic current emissions (equipment input current r 16 A per phase). CENELEC, 2006.
212. Erickson, R. W. and Maksimovic, D. Fundamentals of Power Electronics. 2nd ed. New York, Springer, 2001.
213. Fulton, D. "Reducing Motor Drive Noise." Part 1, Conformity, July 2004. IEEE Std. 519. Recommended Practices and Requirements for Harmonic Control in Electrical Power Systems. IEEE, 1992.
214. Schneider, L. M. "Noise Source Equivalent Circuit Model for Off-Line Converters and its Use in Input Filter Design." IEEE 1993 International Symposium on Electromagnetic Compatibility, Washington, DC, August 1983.
215. Severns, R. Snubber Circuits For Power Electronics, ebook, www.snubberdesign.com/snubber-book.html, Rudolf Severns, 2008.
216. EN 60601-1-2. Medical Electrical Equipment-Part 1-2: General Requirements for Safety-Collateral Standard: Electromagnetic Compatibility-Requirements and Tests, CENELEC, 2007.
217. EN 61000-6-1. Generic Immunity Standard for Residential, Commercial, and Light-Industrial Environments, CENELEC, 2007.
218. EN 61000-6-2. Generic Immunity Standard for Industrial Environments, CENELEC, 2005.
219. German, R. F., Ott H. W., and Paul, C. R. "Effect of an Image Plane on Printed Circuit Board Radiation", IEEE Electromagnetic Compatibility Symposium, Washington, DC, August 21-23, 1990.
220. Industry Canada. EMCAB 1, Issue 3. "Immunity of Electrical/Electronic Equipment Intended to Operate in the Canadian Radio Environment (0.010-10,000 MHz)." Industry Canada, June 1990.
221. ITI (CBEMA) Curve Application Note. Information Technology Industry Council. 2000. Available at www.itic.org/archive/iticurv.pdf.
222. Standler, R. B. Protection of Electronic Circuits from Overvoltage. Wiley, New York, 1989. [Out of print]
223. Standler, R. B. Protection of Electronic Circuits from Overvoltage. Frederica, DE, Dover, 2002 [Paperback reprint of above book].
224. AN-671. Reducing RFI Rectification in Instrumentation Amplifiers. Analog Devices, Norwood, MA, 2003.
225. Lepkowski, J. AND8229/D. An Introduction to Transient Voltage Suppression Devices, ON Semiconductor, 2005.
226. Lepkowski, J. and Johnson, J. Zener Diode Based Integrated Filters, an Alternative to Traditional EMI Filter Devices, ON Semiconductor. General Electric. Transient Voltage Suppression, 5th ed. 1986.
227. DOD-HDBK-263. Electrostatic Discharge Control Handbook. Washington, DC, Department of Defense, May 2, 1980.
228. EN 61000-4-2. Electromagnetic Compatibility (EMC)-Part 4-2: Testing and Measurement Techniques-Electrostatic Discharge Immunity Test, 2001.
229. Hayt, W. H. Engineering Electromagnetics. New York, McGraw-Hill, 1974.
230. Moore, A. D. Electrostatics and its Applications. New York, Wiley, 1973.
231. Palmgren, C. M. "Shielded Flat Cables for EMI and ESD Reduction." 1981 IEEE International Symposium on Electromagnetic Compatibility, Boulder, CO, August 18-20, 1981.
232. Peterson, W. W. and Brown, D. T. "Cyclic Codes for Error Detection." Proceedings of the IRE, January 1961.
233. Anderson, D. C. "ESD Control to Prevent the Spark that Kills." Evaluation Engineering, July 1984.
234. Bhar, T. N. and McMahon, E. J. Electrostatic Discharge Control, New York, Hayden Book Co., 1983.
235. Boxleitner, W. Electrostatic Discharge and Electronic Equipment. New York, IEEE Press, 1989.
236. Calvin, H. , Hyatt, H. , and Mellberg, H. "A Closer Look at the Human ESD Event." EOS/ESD Symposium, 1981.
237. Gerke, D. and Kimmel, W. "Designing Noise Tolerance into Microprocessor Systems." EMC Technology, March-April, 1986.
238. Jowett, C. E. Electrostatics in the Electronics Environment. New York, Halsted Press, 1976.
239. Kimmel, W. D. and Gerke, D. D. "Three Keys to ESD Systems Design." EMC Test & Design, September 1993.
240. King, W. M. and Reynolds, D. "Personal Electrostatic Discharge: Impulse Waveforms Resulting from ESD of Humans Directly and through Small Hand-Held Metallic Objects Intervening in the Discharge Path." 1981 IEEE International Symposium on Electromagnetic Compatibility, Boulder, CO, August 18-20, 1981.
241. Mardiguian, M. Electrostatic Discharge; Understand, Simulate and Fix ESD Problems. Interference Control Technologies, 1986.
242. Mardiguian, M. "ESD Hardening of Plastic Housed Equipment," EMC Test & Design, July/August 1994.
243. Sclater, N. Electrostatic Discharge Protection for Electronics. Blue Ridge Summit, PA, Tab Books, 1990.
244. Violette, J. L. N. "ESD Case History-Immunizing a Desktop Business Machine." EMC Technology, May/June 1986.
245. Wong, S. W. "ESD Design Maturity Test for a Desktop Digital System." Evaluation Engineering, October 1984.
246. Archambeault, B. PCB Design for Real-World EMI Control. Boston, MA: Kluwer Academic Publishers, 2002.
247. Fessler, J. T., Whites, K. W., and Paul, C. R. "The Effectiveness of an Image Plane in Reducing Radiated Emissions." IEEE Transactions on Electromagnetic Compatibility, February 1996.
248. German, R. F., Ott, H. W., and Paul, C. R. "Effect of an Image Plane on Printed Circuit Board Radiation. 1990 IEEE International Symposium on Electromagnetic Compatibility, August 21-23, 1990.
249. Paul, Clayton R. Introduction to Electromagnetic Compatibility, 2nd ed. New York Wiley, 2006.
250. Smith, D. C. Routing Signals Between PWB Layers-Part 2, An Emission Example, 2006. Available at www.dsmith.org. Accessed January 2009.
251. Archambeault, B. "Effects of Routing High-Speed Traces Close to the PCB Edge." Printed Circuit Design & Fab, January 2008.
252. Bogatin, E. "An EMC Sweet 16." Printed Circuit Design & Manufacture, April 2006.
253. Ott, H. W. PCB Stackup, Parts 1 to 6, Henry Ott Consultants, 2002-2004. Available at http://www.hottconsultants.com/tips.html. Accessed January 2009.
254. Ritchey, L. W. Right the First Time, A Practical Handbook on High Speed PCB and System Design, vol. 1, Speeding Edge. May 2003. Available www.speedingedge.com. Accessed April 2009.
255. Kester, W. "A Grounding Philosophy For Mixed-Signal Systems." Electronic Design, Analog Applications Issue, June 23, 1997.
256. King, W. M. "Digital Common-Mode Noise: Coupling Mechanisms and Transfers in the Z-Axis." EDN, September 2, 2004.
257. Nunn, P. "Reference-Clock Generation for Sampled Data Systems." High Frequency Electronics, September 2005.
258. Terrell, D. L. and Keenan, R. K. Digital Design for Interference Specifications, 2nd ed. Pinellas Park, FL, The Keenan Corporation, 1997.
259. Holloway, C. L. and Kuester, E. F. Closes-Form Expressions for the Current Densities on the Ground Plane of Asymmetric Stripline Structures. IEEE Transactions on Electromagnetic Compatibility, February, 2007.
260. Johnson, H. "ADC Grounding." EDN, December. 7, 2000.
261. Johnson, H. "Multiple ADC Grounding." EDN, February. 2001.
262. Johnson, H. "Clean Power." EDN, August. 2000.
263. Kester, W. Mixed-Signal and DSP Design Techniques, Chapter 10, (Hardware Design Techniques). Norwood, MA, Analog Devices, 2003.
264. Kester W. Ask the Application Engineer-12, Grounding (Again), Analog Dialogue 26-2, Norwood, MA, Analog Devices, 1992.
265. Ott, H. W. "Partitioning and Layout of a Mixed-Signal PCB," Printed Circuit Design, June 2001.
266. ANSI C63-4. American National Standard for Methods of Measurement of Radio-Noise Emissions from Low-Voltage Electrical and Electronic Equipment in the Range of 9 kHz to 40 GHz, 2003.
267. CISPR 16-1-1. Specification for Radio Disturbance and Immunity Measuring Apparatus and Methods Part 1-1: Radio Disturbance and Immunity Measuring Apparatus-Measuring Apparatus, International Special Committee on Radio Interference (CISPR), 2006.
268. Cruz, J. E. and Larsen, E. B. Assessment of Error Bounds for Some Typical MILSTD461/462 Types of Measurements. NBS Technical Note 1300, October 1986.
269. Curtis, J. "Toil and Trouble, Boil and Bubble: Brew Up EMI Solutions at Your Own Inexpensive One-Meter EMI Test Site." Compliance Engineering, July/August 1994.
270. FCC. Public Notice 63811, Conditions For The Use of Outdoor Test Ranges For RF Immunity Testing. July 3, 1996.
271. Kolb, L., Reproducibility of Radiated EMI Measurements. Pan Alto, CA, Hewlett Packard, April 15, 1988.
272. Montrose, M. I. and Nakauchi, E. M. "Testing for EMC Compliance," New York, IEEE Press, Wiley Intersciences, 2004.
273. Nave, M. J. Power Line Filter Design for Switched-Mode Power Supplies. New York, Van Nostrand Reinhold, 1991.
274. Paul, C. R. and Hardin, K. B. "Diagnosis and Reduction of Conducted Noise Emissions." 1988 IEEE International Symposium on Electromagnetic Compatibility, Seattle, WA, August 2-4, 1988.
275. Roleson, S. "Evaluate EMI Reduction Schemes with Shielded-Loop Antennas." EDN, May 17, 1984.
276. Schaefer, W. "Narrowband or Broadband Discrimination with a Spectrum Analyzer or EMI Receiver." Conformity, December 2007.
277. Smith, D. C. High Frequency Noise and Measurements in Electronic Circuits. New York, Van Nostrand Reinhold, 1993.
278. Smith, D. C. "DC to 1GHz Probe Construction Plans." 2004. Available http://emcesd.com/1ghzprob.htm. Accessed April 2009.
279. AN-150. Spectrum Analyzer Basics, Agilent Technologies, 2004.
280. AN-1328. Making Precompliance Conducted and Radiated Emissions Measurements with EMC Analyzers, Agilent Technologies, 2000.
281. Gerke, D. and Kimmell, W. EDN The Designer's Guide to Electromagnetic Compatibility, Chapter 13 (EMI Testing: If You Wait to the End, It's Too Late). St. Paul, MN, Kimme Gertes Asssociates, 2001.
282. LISN-UPt Application Note. Fischer Custom Communications, 2005.
283. Roleson, S. "Using Field Probes as EMI Diagnostic Tools." Conformity, March 15, 2007.
284. Roleson, S. "Field Probes as EMI Diagnostic Tools." Conformity, September 2006.
285. Smith, D. C. "Build It! Magnetic Field Probe." Conformity , June 2003.
286. German, R. F. and Ott, H. W. Antenna Theory Simplified. One-Day Seminar, Henry Ott Consultants, 2003.
287. Iizuka, K. "Antennas for Non-Specialists." IEEE Antennas and Propagation, February 2004.
288. Grover, F. W. Inductance Calculations. New York, NY, Dover, 1946. Reprinted in 1973 by the Instrument Society of America, Research Triangle Park, NC.
289. Holloway, C. L. and Kuester E. F. "Net Partial Inductance of a Microstrip Ground Plane." IEEE Transactions on Electromagnetic Compatibility, February 1998.
290. Ruehli, A. "Inductance Calculations in a Complex Integrated Circuit Environment," IBM Journal of Research and Development, September 1972.
291. Skilling, H. H. Electric Transmission Lines. New York, McGraw-Hill, 1951.
292. Weber, E. Electromagnetic Theory. Mineola, NY, Dover, 1965.
293. Hoer, C. and Love, C. "Exact Inductance Equations for Rectangular Conductors with Applications to More Complicated Geometries." Journal of Research of the National Bureau of Standards-C, Engr. Instrum., April-June, 1965.
294. Paul, C. R. "What Do We Mean by 'Inductance'? Part I: Loop Inductance." IEEE EMC Society Newsletter, Fall 2007.
295. Paul, C. R. "What Do We Mean by 'Inductance'? Part II: Partial Inductance." IEEE EMC Society Newsletter, Winter 2008.