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Volumn 1998-September, Issue , 1998, Pages 321-327

Studies of underfill formulation effects using molecular dynamics and discrete element modeling

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; FILLERS; JOINING; MANUFACTURE;

EID: 84889149963     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742048     Document Type: Conference Paper
Times cited : (2)

References (8)
  • 3
    • 0031625556 scopus 로고    scopus 로고
    • Property trend analysis and simulations of adhesive formulation effects in the microelectronics packaging industry using molecular modeling
    • May 25-28 Seattle, WA
    • N. Iwamoto, J. Pedigo; "Property Trend Analysis and Simulations of Adhesive Formulation Effects in the Microelectronics Packaging Industry Using Molecular Modeling"; Proceedings of the Electronic Components and Technology Conference, May 25-28, 1998; Seattle, WA.
    • (1998) Proceedings of the Electronic Components and Technology Conference
    • Iwamoto, N.1    Pedigo, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.