Molecular modeling as a tool for adhesive performance understanding

Materials Research Society Symposium - Proceedings

Volumn 515, Issue , 1998, Pages 23-29

  Iwamoto, N ^a   Pedigo, J ^a   Grieve, A ^a   Li, M ^a  

^a Johnson Matthey Electronics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVES; MATHEMATICAL MODELS; MOLECULAR DYNAMICS; SUBSTRATES;

MOLECULAR MODELLING METHOD;

ELECTRONICS PACKAGING;

EID: 0031641730     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-515-23     Document Type: Conference Paper

References (11)