Electrodeposition mechanism and characterization of Ni-Cu alloy coatings from a eutectic-based ionic liquid

Applied Surface Science

Volumn 288, Issue , 2014, Pages 530-536

  Wang, Shaohua ^a   Guo, Xingwu ^a,b   Yang, Haiyan ^a,b   Dai, Jichun ^a   Zhu, Rongyu ^a   Gong, Jia ^a,b   Peng, Liming ^a,b   Ding, Wenjiang ^a,b  

^a Shanghai Jiao Tong University   (China)

^b SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Corrosion resistance; Electrodeposition; Ionic liquid; Ni Cu alloy; Nucleation

Indexed keywords

BINARY ALLOYS; CHLORINE COMPOUNDS; COPPER ALLOYS; COPPER COMPOUNDS; COPPER DEPOSITS; CORROSION RESISTANCE; CORROSION RESISTANT ALLOYS; CORROSION RESISTANT COATINGS; CYCLIC VOLTAMMETRY; ELECTRODEPOSITION; ELECTRODES; ELECTROLYTES; EUTECTICS; IONIC LIQUIDS; METABOLISM; MICROSTRUCTURE; NICKEL ALLOYS; NICKEL COATINGS; NICKEL COMPOUNDS; NUCLEATION; SOLID SOLUTIONS; UREA;

CHOLINE CHLORIDE; COMPLEXING AGENTS; CRACK-FREE STRUCTURE; DEPOSITION CURRENT DENSITY; ELECTRODEPOSITION MECHANISM; INSTANTANEOUS NUCLEATIONS; NI-CU ALLOY; REDUCTION POTENTIAL;

COPPER CORROSION;

EID: 84888437105     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2013.10.065     Document Type: Article

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