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Volumn 47, Issue , 2013, Pages 105-109

Adhesive bond strength development evaluation using ABES in different lignocellulosic materials

Author keywords

Adhesion by chemical bonding; Adhesives for wood; Mechanical properties of adhesives; Wood

Indexed keywords

ADHESION BY CHEMICAL BONDINGS; ADHESIVE BOND STRENGTHS; ADHESIVES FOR WOOD; HIGH PRESSURE LAMINATES; LIGNOCELLULOSIC MATERIAL; MECHANICAL PROPERTIES OF ADHESIVES; QUANTITATIVE SCREENING; STRENGTH DEVELOPMENT;

EID: 84888303888     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2013.08.003     Document Type: Article
Times cited : (14)

References (21)
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    • Developments of wood based composites and the processing industries
    • Wieland S, Thomas Schnabel T, editors Salzburg/Kuchl, Austria
    • Barbu M. Developments of wood based composites and the processing industries. In: Wieland S, Thomas Schnabel T, editors. 1st workshop of COST - basics for chemistry of wood surface modification. Book of abstracts. Salzburg/Kuchl, Austria; 2012. p. 73-5.
    • (2012) 1st Workshop of COST - Basics for Chemistry of Wood Surface Modification. Book of Abstracts , pp. 73-75
    • Barbu, M.1
  • 4
    • 77951667885 scopus 로고    scopus 로고
    • Cork composites: A review
    • L Gil Cork composites: a review Materials 2 2009 776 789
    • (2009) Materials , vol.2 , pp. 776-789
    • Gil, L.1
  • 8
    • 0347721024 scopus 로고    scopus 로고
    • A Global model for the hot-pressing of medium density fiberboard (MDF)
    • LM Carvalho, MR Costa, and C Costa A Global model for the hot-pressing of medium density fiberboard (MDF) Wood Science and Technology 37 2003 241 258
    • (2003) Wood Science and Technology , vol.37 , pp. 241-258
    • Carvalho, L.M.1    Costa, M.R.2    Costa, C.3
  • 10
    • 84888294840 scopus 로고    scopus 로고
    • Adhesive bond strength development
    • H Thoemen, M Irle, M Sernek, Brunel University Press London
    • M Sernek, and M Dunky Adhesive bond strength development H Thoemen, M Irle, M Sernek, Wood-based panels: an introduction to specialists 2010 Brunel University Press London 203 223
    • (2010) Wood-based Panels: An Introduction to Specialists , pp. 203-223
    • Sernek, M.1    Dunky, M.2
  • 12
  • 14
    • 34249014384 scopus 로고    scopus 로고
    • Application of dielectric analysis for monitoring the cure process of phenol formaldehyde adhesive
    • DOI 10.1016/j.ijadhadh.2006.10.004, PII S014374960600114X
    • M Sernek, and FA Kamke Application of dielectric analysis for monitoring the cure process of phenol formaldehyde adhesive International Journal of Adhesion and Adhesives 27 2007 562 567 (Pubitemid 46802812)
    • (2007) International Journal of Adhesion and Adhesives , vol.27 , Issue.7 , pp. 562-567
    • Sernek, M.1    Kamke, F.A.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.