Sintering behavior of W-30Cu composite powder prepared by electroless plating

International Journal of Refractory Metals and Hard Materials

Volumn 42, Issue , 2014, Pages 51-56

  Luo, Lai Ma ^a,c   Tan, Xiao Yue ^a   Lu, Ze Long ^a   Zhu, Xiao Yong ^a,c   Zan, Xiang ^a,c   Luo, Guang Nan ^b   Wu, Yu Cheng ^a,c  

^a HEFEI UNIVERSITY OF TECHNOLOGY   (China)

^b INSTITUTE OF PLASMA PHYSICS   (China)

^c Engineering Research Center of Powder Metallurgy of Anhui Province   (China)

Author keywords

Electroless plating; Sintering behavior; W Cu composite

Indexed keywords

ELECTRICAL CONDUCTIVITY; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; HOMOGENOUS DISPERSIONS; MICROSTRUCTURE EVALUATIONS; POWDER METALLURGY TECHNIQUES; SINTERING BEHAVIORS; SINTERING TEMPERATURES; W-CU COMPOSITES;

COMPRESSIVE STRENGTH; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; FIELD EMISSION MICROSCOPES; POWDER METALLURGY; TUNGSTEN; X RAY DIFFRACTION;

SINTERING;

EID: 84887429979     PISSN: 02634368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijrmhm.2013.10.012     Document Type: Article

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