Improvement of physical properties of Cu-infiltrated W compacts via electroless nickel plating of primary tungsten powder

Surface and Coatings Technology

Volumn 203, Issue 16, 2009, Pages 2333-2336

  Zangeneh Madar, K ^a   Amirjan, M ^a   Parvin, N ^b  

^a MUT   (Iran)

^b AMIRKABIR UNIVERSITY OF TECHNOLOGY   (Iran)

Author keywords

Electroless nickel plating; Infiltration; Relative density; Tungsten copper composite

Indexed keywords

CONSTANT PRESSURES; CYLINDRICAL SHAPES; ELECTRICAL CONDUCTIVITIES; ELECTROLESS NICKEL PLATING; ELECTROLESS NICKELS; HYDROGEN ATMOSPHERES; LIQUID COPPERS; MICROSTRUCTURAL OBSERVATIONS; RELATIVE DENSITY; SEM; SPECIFIC RESISTIVITIES; TUNGSTEN POWDERS; TUNGSTEN-COPPER COMPOSITE; XRD;

COPPER; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; HYDROGEN; NICKEL; NICKEL ALLOYS; NICKEL PLATING; OPTICAL MICROSCOPY; PHOSPHORUS; POWDERS; SCANNING ELECTRON MICROSCOPY; SEEPAGE; SOIL MECHANICS; TUNGSTEN; TUNGSTEN ALLOYS; TUNGSTEN COMPOUNDS; TUNGSTEN POWDER METALLURGY;

TUNGSTEN PLATING;

EID: 63749130361     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.02.055     Document Type: Article

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