Study of floating fill impact on interconnect capacitance

Proceedings - International Symposium on Quality Electronic Design, ISQED

Volumn , Issue , 2006, Pages 691-696

  Kahng, Andrew B ^a   Samadi, Kambiz ^a   Sharma, Puneet ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLOSE PROXIMITY; CONFIGURATION PARAMETERS; COUPLING CAPACITANCE; EDGE EFFECT; INTERCONNECT CAPACITANCE; METAL DENSITY; PROCESS PARAMETERS;

DESIGN; GEOMETRY; THREE DIMENSIONAL;

CAPACITANCE;

EID: 84886738721     PISSN: 19483287     EISSN: 19483295     Source Type: Conference Proceeding    
DOI: 10.1109/ISQED.2006.126     Document Type: Conference Paper

References (11)

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