Fabrication and characterization of injection molded multi level nano and microfluidic systems

Microelectronic Engineering

Volumn 111, Issue , 2013, Pages 294-298

  Matteucci, Marco ^a   Christiansen, Thomas Lehrmann ^a   Tanzi, Simone ^a   Ostergaard, Peter Friis ^a   Larsen, Simon Tylsgaard ^a   Taboryski, Rafael ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Dry etching Electroplating Injection molding Thermal bonding Lab on chip Microfluidics

Indexed keywords

ASPECT RATIO; DRY ETCHING; ELECTROPLATING; FABRICATION; FLUIDIC DEVICES; MICROFLUIDICS; MOLDING;

BONDING STRENGTH; FABRICATION AND CHARACTERIZATIONS; MICRO FLUIDIC SYSTEM; MICROFLUIDIC CHIP; MICROPATTERNED SUBSTRATES; SEALING PROCESS; SIMPLE MODELING; THERMAL BONDING;

INJECTION MOLDING;

EID: 84885189386     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2013.01.060     Document Type: Article

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