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Volumn 103, Issue 4, 2013, Pages

Benefit of inserting a (Cu/Pt) intermixing dual barrier for the blocking temperature distribution of exchange biased Co/(Cu/Pt)/IrMn stacks

Author keywords

[No Author keywords available]

Indexed keywords

ANTIFERROMAGNETICS; BLOCKING TEMPERATURE DISTRIBUTION; DEVICE PERFORMANCE; EXCHANGE BIAS; INTERFACIAL QUALITIES; SPINTRONICS DEVICE;

EID: 84884991144     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4816816     Document Type: Article
Times cited : (14)

References (36)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.