A specific chemical activation pretreatment for electroless nickel plating on SiC ceramic powders

Powder Technology

Volumn 249, Issue , 2013, Pages 431-435

  Luo, Lai Ma ^a   Lu, Ze Long ^a   Tan, Xiao Yue ^a   Ding, Xiao Yu ^a   Huang, Li Mei ^a   Cheng, Ji Gui ^a   Zhu, Liu ^b   Wu, Yu Cheng ^a  

^a HEFEI UNIVERSITY OF TECHNOLOGY   (China)

^b TAIZHOU UNIVERSITY   (China)

Author keywords

Chemical activation pretreatment; Electroless plating; Ni layer; SiC ceramic powders

Indexed keywords

CHEMICAL DEPOSITION METHOD; CONVENTIONAL SENSITIZATION; ELECTROLESS NICKEL PLATING; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; PRE-TREATMENT; PRETREATMENT METHODS; SIC CERAMIC POWDER; UNIFORM DISTRIBUTION;

CERAMIC COATINGS; CHEMICAL ACTIVATION; DEPOSITION; ELECTROLESS PLATING; FIELD EMISSION MICROSCOPES; POWDERS; REDOX REACTIONS; SILICON CARBIDE;

NICKEL;

BENZENE; BENZOTRIAZOLE DERIVATIVE; HYDROFLUORIC ACID; NICKEL; NITRIC ACID; SILICON CARBIDE;

ABSORPTION; AQUEOUS SOLUTION; ARTICLE; CERAMICS; CHEMICAL COMPOSITION; CORROSION; ENERGY DISPERSION SPECTROMETRY; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; MATERIAL COATING; OXIDATION REDUCTION REACTION; ROOM TEMPERATURE; SPECTROMETRY; SURFACE PROPERTY; ULTRASOUND;

EID: 84884968355     PISSN: 00325910     EISSN: 1873328X     Source Type: Journal    
DOI: 10.1016/j.powtec.2013.08.039     Document Type: Article

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