Simple and fast microwave-enhanced wet etching of SiC particles for electroless Ni-P plating

Surface and Coatings Technology

Volumn 161, Issue 1, 2002, Pages 79-85

  Kang, Min ^a   Man Kim, Ji ^a   Won Kim, Jin ^a   Kil Kim, Young ^b   Chung, Hyungsik ^a   Yie, Jae Eui ^a  

^a Ajou University   (South Korea)

^b Osan University   (South Korea)

Author keywords

Electroless metal plating; Microwave enhanced etching; Ni P; SiC particles; Surface modification

Indexed keywords

ADHESION; COMPOSITE MATERIALS; MICROWAVES; PLATING;

SURFACE OXIDE SPECIES;

ETCHING;

ELECTROLESS PLATING; ETCHING; MICROWAVE DRYING; NICKEL ALLOY; SILICON CARBIDE;

EID: 0036837177     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(02)00326-2     Document Type: Article

References (26)