Integration of polymer microfluidic channels, vias, and connectors with silicon photonic sensors by one-step combined photopatterning and molding of OSTE

2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Volumn , Issue , 2013, Pages 1613-1616

  Errando Herranz, Carlos ^a,b   Saharil, Farizah ^a   Romero, Albert Mola ^a,c   Sandstrom, Niklas ^a   Shafagh, Reza Zandi ^a   Van Der Wijngaart, Wouter ^a   Haraldsson, Tommy ^a   Gylfason, Kristinn B ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b UNIVERSITAT POLITÈCNICA DE VALÈNCIA   (Spain)

^c UNIVERSITY OF BARCELONA   (Spain)

Author keywords

microfluidics; molding; Off Stoichiometry Thiol Ene; OSTE; photopatterning; Silicon photonics; wafer level packaging

Indexed keywords

OSTE; PHOTO PATTERNING; SILICON PHOTONICS; THIOL-ENES; WAFER LEVEL PACKAGING;

ACTUATORS; MICROSYSTEMS; MOLDING; OPTICAL FIBER FABRICATION; OPTICAL FIBERS; PHOTONIC DEVICES; PHOTONICS; SOLID-STATE SENSORS;

MICROFLUIDICS;

EID: 84884543046     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/Transducers.2013.6627092     Document Type: Conference Paper

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