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Volumn 61, Issue 18, 2013, Pages 6736-6742

Employment of a bi-layer of Ni(P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects

Author keywords

Bonding; Cu; Diffusion barrier; NiP; Sn

Indexed keywords

BONDING STRUCTURE; ELECTROLESS-PLATED NI; FRACTURE ANALYSIS; MATERIALS ANALYSIS; MATERIALS INTERACTION; MECHANICAL CHARACTERIZATIONS; MECHANICAL RELIABILITY; NIP;

EID: 84884291752     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2013.07.043     Document Type: Article
Times cited : (32)

References (10)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.