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Volumn 61, Issue 18, 2013, Pages 6736-6742
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Employment of a bi-layer of Ni(P)/Cu as a diffusion barrier in a Cu/Sn/Cu bonding structure for three-dimensional interconnects
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Author keywords
Bonding; Cu; Diffusion barrier; NiP; Sn
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Indexed keywords
BONDING STRUCTURE;
ELECTROLESS-PLATED NI;
FRACTURE ANALYSIS;
MATERIALS ANALYSIS;
MATERIALS INTERACTION;
MECHANICAL CHARACTERIZATIONS;
MECHANICAL RELIABILITY;
NIP;
BONDING;
COPPER;
DIFFUSION BARRIERS;
MICROSTRUCTURE;
NICKEL;
THREE DIMENSIONAL;
TIN;
COPPER COMPOUNDS;
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EID: 84884291752
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2013.07.043 Document Type: Article |
Times cited : (32)
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References (10)
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