Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper

Electronic Materials Letters

Volumn 9, Issue 5, 2013, Pages 669-676

  Cook, Benjamin S ^a   Fang, Yunnan ^b   Kim, Sangkil ^a   Le, Taoran ^a   Goodwin, W Brandon ^b   Sandhage, Kenneth H ^b,c   Tentzeris, Manos M ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

antennas; copper metallization; flexible and recyclable substrates; inkjet printed electronics; paper bearing electronics; RF devices

Indexed keywords

COPPER METALLIZATION; ELECTROLESS COPPER DEPOSITION; ELEVATED TEMPERATURE; INKJET-PRINTED ELECTRONICS; MICROWAVE COMPONENTS; MICROWAVE PASSIVE DEVICES; RF DEVICES; SILVER NANOPARTICLES;

ANTENNAS; CATALYSTS; COPPER; COPPER DEPOSITS; COSTS; DEPOSITION; ELECTROLESS PLATING; FLEXIBLE ELECTRONICS; INK; INK JET PRINTERS; MICROWAVE DEVICES; PAPER; PRINTING; SILVER; SUBSTRATES; SYNTHESIS (CHEMICAL);

DIRECTIONAL PATTERNS (ANTENNA);

COPPER; COSTS; DEPOSITION; ELECTRONICS; INK JET PRINTING; PLATING; SUBSTRATES; SYNTHESIS;

EID: 84883808468     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-013-3027-0     Document Type: Article

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