Easy to use uncooled 1/4VGA 17 μm FPA development for high performance compact and low-power systems

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8353, Issue , 2012, Pages

  Robert, P ^a   Tissot, J L ^a   Pochic, D ^a   Gravot, V ^a   Bonnaire, F ^a   Clerambault, H ^a   Durand, A ^a   Tinnes, S ^a  

^a ULIS   (France)

Author keywords

amorphous silicon technology; IRFPA; LWIR; Uncooled microbolometer

Indexed keywords

AMORPHOUS SILICON; BOLOMETERS; INFRARED RADIATION;

DETECTOR CONFIGURATION; IRFPA; LOW-POWER CONSUMPTION; LWIR; OPERATIONAL CONDITIONS; SILICON TECHNOLOGIES; THERMAL TIME CONSTANTS; UNCOOLED MICROBOLOMETERS;

PIXELS;

EID: 84883784560     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.920996     Document Type: Conference Paper

References (6)

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2. TROUILLEAU C., et al., "Uncooled amorphous silicon 160 x 120 IRFPA with 25-μ m pixel-pitch for large volume applications", Infrared Technology and Applications XXXIII, Proceedings of SPIE Vol. 6542, (2007)
3. VIEIDER C., et al., "Low-cost far infrared bolometer camera for automotive use", Infrared Technology and Applications XXXIII, Proceedings of SPIE Vol. 6542, (2007)
4. DURAND A. et al., "VGA 17 μ m development for compact, low power systems", Infrared technology and applications XXXVII, Proc SPIE Vol. 8012, (2011)
5. ROBERT P. et al., "Specifications of A to D Converter for uncooled infrared ROIC", Detectors and associated signal processing IV, Proc SPIE Vol. 8176, (2011)
6. FIEQUE B. et al., "Uncooled amorphous silicon XGA IRFPA with 17 μ m pixel pitch for high end applications", Infrared technology and applications XXXIV, Proc SPIE Vol. 6940, (2008)