Designing robust alumina nanowires-on-nanopores structures: Superhydrophobic surfaces with slippery or sticky water adhesion

Journal of Colloid and Interface Science

Volumn 409, Issue , 2013, Pages 18-24

  Peng, Shan ^a   Tian, Dong ^a   Miao, Xinrui ^a   Yang, Xiaojun ^a   Deng, Wenli ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Adhesion; Aluminum; Dual nanostructures; Electrochemical techniques; Hydrophobicity; Mechanical durability

Indexed keywords

ANODIZATION METHOD; ELECTROCHEMICAL TECHNIQUES; HYBRID NANOSTRUCTURES; HYDROPHOBIC COATINGS; MECHANICAL DURABILITY; SELF ASSEMBLY PROCESS; SUPER-HYDROPHOBIC SURFACES; SUPERHYDROPHOBICITY;

ADHESION; ALUMINA; ALUMINUM; DURABILITY; MORPHOLOGY; NANOPORES; NANOWIRES; SILICA GEL;

HYDROPHOBICITY;

ALUMINUM OXIDE; NANOMATERIAL; NANOWIRE; ORGANIC SOLVENT; SILICA GEL; WATER;

ADHESION; ALUMINUM FOIL; ARTICLE; CHEMICAL COMPOSITION; CHEMICAL MODIFICATION; CHEMICAL STRUCTURE; CONTACT ANGLE; CONTAMINATION; ELECTROCHEMICAL ANALYSIS; HIGH TEMPERATURE; HYDROPHOBICITY; MORPHOLOGY; NANOPORE; PRIORITY JOURNAL; SELF CONCEPT; SURFACE PROPERTY; WETTABILITY;

EID: 84883557932     PISSN: 00219797     EISSN: 10957103     Source Type: Journal    
DOI: 10.1016/j.jcis.2013.07.059     Document Type: Article

References (62)

1. Feng L., Li S., Li Y., Li H., Zhang L., Zhai J., Song Y., Liu B., Jiang L., Zhu D. Adv. Mater. 2002, 14:1857.
2. Li X.M., Reinhoudt D., Crego-Calama M. Chem. Soc. Rev. 2007, 36:1350.
3. Fürstner R., Barthlott W., Neinhuis C., Walzel P. Langmuir 2005, 21:956.
4. Li Y., Liu F., Sun J. Chem. Commun. 2009, 2730.
5. Zhu W., Feng X., Feng L., Jiang L. Chem. Commun. 2006, 26:2753.
6. Sun T., Feng L., Gao X., Jiang L. Acc. Chem. Res. 2005, 38:644.
7. Feng X., Jiang L. Adv. Mater. 2006, 18:3063.
8. Satyaprasad A., Jain V., Nema S.K. Appl. Surf. Sci. 2007, 253:5462.
9. Ma M., Gupta M., Li Z., Zhai L., Gleason K.K., Cohen R.E., Rubner M.F., Rutledge G.C. Adv. Mater. 2007, 19:255.
10. Ma M., Mao Y., Gupta M., Gleason K.K., Rutledge G.C. Macromolecules 2005, 38:9742.
11. Zhang X., Shi F., Yu X., Liu H., Fu Y., Wang Z., Jiang L., Li X. J. Am. Chem. Soc. 2004, 126:3064.
12. Li J., Guo Z., Liu J.H., Huang X.J. J. Phys. Chem. C 2011, 115:16934.
13. Chen Z., Guo Y., Fang S. Surf. Interface Anal. 2010, 42:1.
14. Wu W., Wang X., Wang D., Chen M., Zhou F., Liu W., Xue Q. Chem. Commun. 2009, 9:1043.
15. Lafuma A., Quere D. Nat. Mater. 2003, 2:457.
16. Blossey R. Nat. Mater. 2003, 2:301.
17. Erbil H.Y., Demirel A.L., Avci Y., Mert O. Science 2003, 299:1377.
18. Bhushan B., Nosonovsky M. T. Roy. Soc. A 2010, 368:4713.
19. Nosonovsky M., Bhushan B. Green Tribol. 2012, 25.
20. Feng L., Zhang Y., Xi J., Zhu Y., Wang N., Xia F., Jiang L. Langmuir 2008, 24:4114.
21. Bhushan B., Her E.K. Langmuir 2010, 26:8207.
22. Stanton M.M., Ducker R.E., MacDonald J.C., Lambert C.R., Grant McGimpsey W. J. Colloid Interface Sci. 2012, 367:502.
23. Xia F., Jiang L. Adv. Mater. 2008, 20:2842.
24. Nosonovsky M., Bhushan B. Adv. Funct. Mater. 2008, 18:843.
25. Ebert D., Bhushan B. J. Colloid Interface Sci. 2012, 384:182.
26. Wenzel R.N. Ind. Eng. Chem. 1936, 28:988.
27. Cassie A., Baxter S. Trans. Faraday Soc. 1944, 40:546.
28. Cheng Z., Lai H., Du M., Zhu S., Zhang N., Sun K. Soft Matter 2012, 8:9635.
29. Lai Y., Lin C., Huang J., Zhuang H., Sun L., Nguyen T. Langmuir 2008, 24:3867.
30. Wang M., Chen C., Ma J., Xu J. J. Mater. Chem. 2011, 21:6962.
31. Zhu S., Li Y., Zhang J., Lü C., Dai X., Jia F., Gao H., Yang B. J. Colloid Interface Sci. 2010, 344:541.
32. Dawood M., Zheng H., Liew T., Leong K., Foo Y., Rajagopalan R., Khan S., Choi W. Langmuir 2011, 27:4126.
33. Cheng Z., Du M., Lai H., Zhang N., Sun K. Nanoscale 2013, 5:2776.
34. Li J., Liu X., Ye Y., Zhou H., Chen J. J. Phys. Chem. C 2011, 115:4726.
35. Urase T., Yamamoto K., Ohgaki S. J. Membr. Sci. 1996, 115:21.
36. Zhang J., Hong G. J. Solid State Chem. 2004, 177:1292.
37. Yi J., Pan H., Lin J., Ding J., Feng Y., Thongmee S., Liu T., Gong H., Wang L. Adv. Mater. 2008, 20:1170.
38. Wu Z., Zhang Y., Du K. Appl. Surf. Sci. 2012, 265:149.
39. Piao Y., Kim H. J. Nanosci. Nanotechnol. 2009, 9:2215.
40. Shingubara S. J. Nanopart. Res. 2003, 5:17.
41. Fu X., Zhang B., Kang X., Deng J., Xiong C., Dai T., Jiang X., Yu T., Chen Z., Zhang G.Y. Opt. Express 2011, 19:A1104.
42. Chen Z., Lu C. Sens. Lett. 2005, 3:274.
43. Han J., Kim J., Choi Y., Chang K.-S., Lee J., Youn H., Bu S. Physica E 2007, 36:140.
44. Zuo Y., Zhao Y., Li X., Li N., Bai X., Qiu S., Yu W. Mater. Lett. 2006, 60:2937.
45. Meier L., Alvarez A., Salinas D., Del Barrio M. Mater. Lett. 2012, 70:119.
46. Xiao Z., Han C.Y., Welp U., Wang H., Kwok W., Willing G., Hiller J., Cook R., Miller D., Crabtree G. Nano Lett. 2002, 2:1293.
47. Yao L., Zheng M., Ma L., Li W., Li M., Shen W. Mater. Res. Bull. 2011, 46:1403.
48. Kim Y., Lee S., Cho H., Park B., Kim D., Hwang W. ACS Appl. Mater. Interfaces 2012, 4:5074.
49. Jeong C., Choi C.-H. ACS Appl. Mater. Interfaces 2012, 4:842.
50. Huang L.-F., Saito M., Miyagi M., Wada K. Appl. Opt. 1993, 32:2039.
51. Parkhutik V., Shershulsky V. Appl. Phys. 1992, 25:1258.
52. Yu W.H., Fei G.T., Chen X.M., Xue F.H., Xu X.J. Phys. Lett. A 2006, 350:392.
53. Zaraska L., Sulka G.D., Szeremeta J., Jaskuła M. Electrochim. Acta 2010, 55:4377.
54. Fratila-Apachitei L., Tichelaar F., Thompson G., Terryn H., Skeldon P., Duszczyk J., Katgerman L. Electrochim. Acta 2004, 49:3169.
55. Tsangaraki-Kaplanoglou I., Theohari S., Dimogerontakis T., Wang Y.-M., Kuo H.-H.H., Kia S. Surf. Coat. Technol. 2006, 200:2634.
56. Fratila-Apachitei L., Terryn H., Skeldon P., Thompson G., Duszczyk J., Katgerman L. Electrochim. Acta 2004, 49:1127.
57. Habazaki H., Shimizu K., Skeldon P., Thompson G., Wood G. Corros. Sci. 2001, 43:1393.
58. Ran C., Ding G., Liu W., Deng Y., Hou W. Langmuir 2008, 24:9952.
59. Lai Y., Gao X., Zhuang H., Huang J., Lin C., Jiang L. Adv. Mater. 2009, 21:3799.
60. Gao L., McCarthy T.J. J. Am. Chem. Soc. 2006, 128:9052.
61. Li J., Liu X., Ye Y., Zhou H., Chen J. Colloids Surf., A 2011, 384:109.
62. Liu Y., Chen X., Xin J. J. Mater. Chem. 2009, 19:5602.