Design for reliability of multi-layer thin film stretchable interconnects

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 623-628

  Hsu, Yung Yu ^a   Lucas, Kylie ^a   Davis, Dan ^a   Ghaffari, Rooz ^a   Elolampi, Brian ^a   Dalal, Mitul ^a   Work, John ^a   Lee, Stephen ^a   Rafferty, Conor ^a   Dowling, Kevin ^a  

^a MC10 Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYSIS AND SIMULATION; BIOMEDICAL DEVICES; DESIGN FOR RELIABILITY; ELECTROMECHANICAL MEASUREMENTS; ELECTRONIC SYSTEMS; FAILURE MECHANISM; MICROCRACK FORMATION; MULTI-LAYER THIN FILM;

ELECTRONICS ENGINEERING;

EID: 84883387654     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575638     Document Type: Conference Paper

References (9)

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