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Volumn , Issue , 2013, Pages 1024-1030
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Effect of NCFs with Zn-nanoparticles on the interfacial reactions of 40 um pitch Cu pillar/Sn-Ag bump for TSV interconnection
a a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
CU PILLAR;
CURING SPEED;
REFLOW TEMPERATURES;
RESIN CURING;
RESIN VISCOSITY;
SOLDER BUMP;
TEST VEHICLE;
ZN CONTENT;
NANOPARTICLES;
RESINS;
SILVER;
TIN;
VISCOSITY;
ZINC;
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EID: 84883357488
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2013.6575698 Document Type: Conference Paper |
Times cited : (2)
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References (2)
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