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Volumn , Issue , 2013, Pages 1024-1030

Effect of NCFs with Zn-nanoparticles on the interfacial reactions of 40 um pitch Cu pillar/Sn-Ag bump for TSV interconnection

Author keywords

[No Author keywords available]

Indexed keywords

CU PILLAR; CURING SPEED; REFLOW TEMPERATURES; RESIN CURING; RESIN VISCOSITY; SOLDER BUMP; TEST VEHICLE; ZN CONTENT;

EID: 84883357488     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575698     Document Type: Conference Paper
Times cited : (2)

References (2)
  • 1
    • 35248860213 scopus 로고    scopus 로고
    • Effects of minor additions of zn on interfacial reactions of sn-ag-cu and sn-cu solders with various cu substrates during thermal aging
    • MOON GI CHO, SUNG K. KANG DA-YUAN SHIH and HYUCK MO LEE, "Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging," Journal of Electronic Materials, vol. 36, issue 11, pp 1501-1509
    • Journal of Electronic Materials , vol.36 , Issue.11 , pp. 1501-1509
    • Moon, G.C.1    Sung, K.K.2    Da-Yuan, S.3    Hyuck, M.L.4
  • 2
    • 78049510653 scopus 로고    scopus 로고
    • Effects of zn-containing flux on sn-3.5ag soldering with an electroless ni-p/au surface finish: Microstructure and wettability
    • HITOSHI SAKURAI, ALONGHENG BAATED, KIJU LEE, SEONGJUN KIM, KEUN-SOO KIM, YOUICHI KUKIMOTO, SEISHI KUMAMOTO, and KATSUAKI SUGANUMA, "Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability," Journal of Electronic Materials, vol 39, issue 12, pp 2598-2604
    • Journal of Electronic Materials , vol.39 , Issue.12 , pp. 2598-2604
    • Hitoshi, S.1    Alongheng, B.2    Kiju, L.3    Seongjun, K.4    Keun-Soo, K.5    Youichi, K.6    Seishi, K.7    Katsuaki, S.8


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.