Vacuum packaged silicon mems gyroscope with Q-factor above 0.5 million

International Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Global Business Council, GBC 2010 Spring Conference

Volumn 2, Issue , 2010, Pages 1100-1126

  Trusov, A A ^a   Schofield, A R ^a   Shkel, A M ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LINEAR TEMPERATURE; Q-FACTORS; QUALITY FACTORS; SILICON MEMS GYROSCOPES; TEMPERATURE STABLE;

EXHIBITIONS;

EID: 84880052672     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. A.A. Trusov, A.R. Schofield, A.M. Shkel, "Micromachined Tuning Fork Gyroscopes with Ultra-High Sensitivity and Shock Rejection," US Patent pending, UC Case No 2009-748-1.
2. A.A. Trusov, A.R. Schofield, A.M. Shkel, "Gyroscope Architecture with Structurally Forced Anti-Phase Drive-Mode and Linearly Coupled Anti-Phase Sense-Mode," Transducers 2009 Conference, Denver, CO, USA, June 21-25, 2009.
3. A.R. Schofield, A.A. Trusov, A.M. Shkel, "Versatile Sub-mTorr Vacuum Packaging for the Experimental Study of Resonant MEMS," IEEE MEMS 2010 Conference, Hong Kong, January 24-28, 2010.
4. Y. Xie, S. Li, Y. Lin, Z. Ren, C. Nguyen, "1.52-GHz Micromechanical Extensional Wine-Glass Mode Ring Resonators," IEEE Trans. Ultrasonics, Ferroelectrics and Frequency Control, Vol. 55, No. 4, pp. 890-907, April 2008.
5. S. Lee, J. Cho, S. Lee, M.F. Zaman, F. Ayazi, K. Najafi, "A Low Power Oven-Controlled Vacuum Package Technology for High Performance MEMS," IEEE MEMS 2009, Sorento, Italy, January 2009, pp. 753-756.