Versatile vacuum packaging for experimental study of resonant MEMS

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2010, Pages 516-519

  Schofield, Adam R ^a   Trusov, Alexander A ^a   Shkel, Andrei M ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIE SIZE; EXPERIMENTAL STUDIES; MECHANICAL DESIGN; MEMS INDUSTRY; PACKAGING PROCESS; PERFORMANCE DYNAMICS; PROCESSING STEPS; QUALITY FACTORS; TUNING FORK GYROSCOPES; VACUUM LEVEL; VACUUM PACKAGING;

ENERGY DISSIPATION; MECHANICAL ENGINEERING; MECHANICS; PACKAGING; REACTIVE ION ETCHING;

VACUUM;

EID: 77952757627     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2010.5442453     Document Type: Conference Paper

References (7)

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