Novel strain relief design for multilayer thin film stretchable interconnects

IEEE Transactions on Electron Devices

Volumn 60, Issue 7, 2013, Pages 2338-2345

  Hsu, Yung Yu ^a   Lucas, Kylie ^a,b   Davis, Dan ^a   Elolampi, Brian ^a   Ghaffari, Roozbeh ^a   Rafferty, Conor ^a   Dowling, Kevin ^a  

^a MC10 Inc   (United States)

^b DARTMOUTH COLLEGE   (United States)

Author keywords

Failure analysis; finite element methods; flexible electronics; integrated circuit interconnections; integrated circuit packaging; materials reliability; strain; stress

Indexed keywords

ELECTROMECHANICAL MEASUREMENTS; ELECTRONIC SYSTEMS; FAILURE MECHANISM; INTEGRATED CIRCUIT INTERCONNECTIONS; INTEGRATED CIRCUIT PACKAGING; MATERIALS RELIABILITIES; MICROCRACK FORMATION; MULTI-LAYER THIN FILM;

FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLEXIBLE ELECTRONICS; MULTILAYERS; STRAIN; STRESSES;

FILM PREPARATION;

EID: 84879968337     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2013.2264217     Document Type: Article

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