Preparation of heat-moisture resistant epoxy resin based on phosphazene

Journal of Applied Polymer Science

Volumn 130, Issue 1, 2013, Pages 248-255

  Huang, Xiaobin ^a   Wei, Wei ^b   Wei, Hao ^a   Li, Yonghua ^c   Gu, Xiaojun ^b   Tang, Xiaozhen ^b  

^a Shanghai Jiao Tong University   (China)

^b SHANGHAI JIAO TONG UNIVERSITY   (China)

^c KingFa Sci and TechCo Ltd   (China)

Author keywords

differential scanning calorimetry; flame retardance; properties and characterization; resins; thermal properties

Indexed keywords

CURING AGENTS; CURING TEMPERATURE; DIFFERENTIAL SCANNING CALORIMETERS; FLAME RETARDANCY; FLAME-RETARDANCE; HEXACHLOROCYCLOTRIPHOSPHAZENE; INSULATION PROPERTY; WET CONDITIONS;

CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC PROPERTIES; HEAT RESISTANCE; MOISTURE; RESINS; THERMODYNAMIC PROPERTIES;

EPOXY RESINS;

EID: 84879923242     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.39050     Document Type: Article

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