Cure kinetics and thermal properties of tetramethylbiphenyl epoxy resin/phthalazinone- containing diamine/hexa(phenoxy) cyclotriphophazene system

Journal of Applied Polymer Science

Volumn 114, Issue 3, 2009, Pages 1397-1404

  Zhang, Xinghong ^a   Zhou, Boxuan ^a   Sun, Xueke ^a   Qi, Guorong ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Cure kinetic; Curing of polymers; Epoxy resins; Thermal properties

Indexed keywords

CHAR YIELD; CONTROLLED REACTIONS; CURE KINETIC; CURE KINETICS; CURED EPOXY RESINS; CURING OF POLYMERS; CURING REACTIONS; CURING SYSTEM; DECOMPOSITION TEMPERATURE; DIFFERENTIAL SCANNING CALORIMETERS; DIFFUSION CONTROLLED REACTIONS; EFFECTIVE ACTIVATION ENERGY; ELECTRONIC MATERIALS; EPOXY SYSTEMS; GLASS TRANSITION TEMPERATURE; HALOGEN-FREE; ISO-CONVERSIONAL METHOD; KINETIC ANALYSIS; NONISOTHERMAL; PHYSICAL STATE; THERMAL PROPERTIES; THERMAL STABILITY;

ACTIVATION ANALYSIS; ACTIVATION ENERGY; CURING; FIRE FIGHTING EQUIPMENT; GLASS TRANSITION; PHENOXY RESINS; RESINS; THERMODYNAMIC PROPERTIES;

EPOXY RESINS;

CURING (CHEMISTRY); DECOMPOSITION; DIFFUSION; ELECTRICAL CIRCUIT; EPOXY RESIN; FLAME RESISTANCE; THERMAL PROPERTY; VISCOSITY;

EID: 68749098275     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.30723     Document Type: Article

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