The synthesis of silicon-containing epoxy resin and its application in environmentally-friendship epoxy molding compound for IC packaging

Advanced Materials Research

Volumn 211-212, Issue , 2011, Pages 638-642

  Yang, Ming Shan ^a   Liu, Jian Wei ^b   Li, Lin Kai ^c  

^a BEIJING INSTITUTE OF PETROCHEMICAL TECHNOLOGY   (China)

^b BEIJING UNIVERSITY OF CHEMICAL TECHNOLOGY   (China)

^c Guangdong Rongtai Industry Co Ltd   (China)

Author keywords

Environmentally friendship retardance; Epoxy molding compound; Large scale integrated circuit packaging; Silicon containing epoxy resin; Synthesis

Indexed keywords

CHEMICAL STRUCTURE; CURING KINETICS; CURING REACTIONS; CURING TEMPERATURE; EPOXY MOLDING COMPOUND; EPOXY MOLDING COMPOUNDS; FTIR; IC PACKAGING; KISSINGER; LARGE-SCALE INTEGRATED CIRCUIT PACKAGING; NON-ISOTHERMAL DSC; NOVOLAC EPOXY; OZAWA METHOD; RETARDANCE; SYNTHESIS; THERMAL STABILITY;

ACTIVATION ENERGY; CURING; EPOXY RESINS; INTEGRATED CIRCUITS; INTELLIGENT MATERIALS; INTELLIGENT MECHATRONICS; MECHATRONICS; MOLDING; SHEET MOLDING COMPOUNDS; SILICON COMPOUNDS; SYNTHESIS (CHEMICAL); SYNTHETIC RESINS; THERMODYNAMIC STABILITY;

SILICON;

EID: 79952774028     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.211-212.638     Document Type: Conference Paper

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