Interfacial adhesive properties between a rigid-rod pyromellitimide molecular layer and a covalent semiconductor via atomistic simulations

ACS Applied Materials and Interfaces

Volumn 5, Issue 11, 2013, Pages 4702-4711

  Makeev, Maxim A ^a   Geubelle, Philippe H ^b   Sottos, Nancy R ^b   Kieffer, John ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

adhesion; glass transition; interface; molecular dynamics; polyimide; structure property relations

Indexed keywords

ADHESIVE INTERACTION; ATOMISTIC SIMULATIONS; COVALENT SEMICONDUCTORS; INTERFACIAL BONDING STRENGTH; INTERFACIAL STRENGTH; PREFERRED ORIENTATIONS; STRUCTURAL DEVELOPMENT; STRUCTURE PROPERTY RELATION;

ADHESION; FORECASTING; GLASS TRANSITION; INTERFACES (MATERIALS); MOLECULAR DYNAMICS; POLYIMIDES;

DIMERS;

EID: 84879093505     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am3031163     Document Type: Article

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