An adaptive diagnosis system for copper wire bonding process control and quality assessment in integrated circuit assembly

International Journal of Computer Integrated Manufacturing

Volumn 26, Issue 6, 2013, Pages 513-526

  Tsai, Tsung Nan ^a  

^a SHU TE UNIVERSITY   (Taiwan)

Author keywords

fuzzy inference system; grey relational analysis; IC assembly; neurofuzzy technique; wire bonding

Indexed keywords

ADAPTIVE CONTROL SYSTEMS; COPPER; FUZZY INFERENCE; FUZZY RULES; GRAPHICAL USER INTERFACES; INTEGRATED CIRCUIT DESIGN; INTEGRATED CIRCUITS; MEMBERSHIP FUNCTIONS; MICROELECTRONICS; PROGRAM DIAGNOSTICS; TIMING CIRCUITS; WIRE;

ELECTRONICS MANUFACTURING SERVICES; FRACTIONAL FACTORIAL EXPERIMENTAL DESIGN; FUZZY INFERENCE SYSTEMS; GREY RELATIONAL ANALYSES (GRA); GREY RELATIONAL ANALYSIS; MULTIPLE QUALITY CHARACTERISTICS; NEURO-FUZZY TECHNIQUES; WIRE BONDING;

PROCESS CONTROL;

EID: 84878714821     PISSN: 0951192X     EISSN: 13623052     Source Type: Journal    
DOI: 10.1080/0951192X.2012.731614     Document Type: Article

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