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Volumn , Issue , 2004, Pages 533-541
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A mechanics-based strain gage methodology for solder joint reliability assessment
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Author keywords
[No Author keywords available]
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Indexed keywords
LOADING CONFIGURATIONS;
PACKAGE CONFIGURATIONS;
STRAIN DISTRIBUTION;
COMPUTER SIMULATION;
FINITE ELEMENT METHOD;
INTERMETALLICS;
PRINTED CIRCUIT BOARDS;
RELIABILITY;
STRAIN;
STRAIN GAGES;
STRESS CONCENTRATION;
STRESSES;
SOLDERED JOINTS;
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EID: 3843085007
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (9)
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References (0)
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