Evaluation of direct bond aluminum substrates for power electronic applications in extreme environments

Proceedings - IMAPS/ACerS 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2012

Volumn , Issue , 2012, Pages 12-17

  Patterson, Brian ^a   Kulkarni, Srikanth ^a   Elshabini, Aicha ^a   Barlow, Fred ^a  

^a UNIVERSITY OF IDAHO   (United States)

Author keywords

Active metal bond braze (AMB) substrates; Direct bonded aluminum (DBA); Direct bonded copper (DBC); High temperature thermal shock; Surface roughness

Indexed keywords

ACTIVE METALS; BONDED ALUMINUM; DIRECT BONDED COPPERS; EXTREME TEMPERATURES; HIGH POWER APPLICATIONS; HIGH TEMPERATURE; MECHANICAL RELIABILITY; POWER ELECTRONIC APPLICATIONS;

ALUMINUM; BRAZING; CERAMIC MATERIALS; COPPER; EXHIBITIONS; METALS; MICROSYSTEMS; NICKEL; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; THERMAL CYCLING; THERMAL SHOCK;

SUBSTRATES;

EID: 84877791125     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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