Hermetic package leak testing re-visited

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference

Volumn , Issue , 2008, Pages 139-144

  Kullberg, Richard C ^a   Lowry, Robert K ^a  

^a Technical Affiliates Oneida Research   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84877270293     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. MIL-STD 883E, Test Method 1014.
2. J. Pernicka, "Cumulative Helium Leak Detection (CHLD)", Military, Aerospace, Space, and Homeland Security 2007, May 7-10, 2007, Baltimore, MD
3. Radifo document iv J. G. Davy, "Calculations for leak rates of hermetic packages", IEEE Transactions on Party, Hybrids, and Packaging, vol. PHP-11, No. 3, Sept., 1975, pp. 177-189.
4. J. G. Davy, "How to raise the permissible leak rate by four orders of magnitude", NBSIR 84-2852, RADC/NBS Workshop, Moisture Measurement and Control for Semiconductor Devices, III, May, 1984, pp. 180-195.
5. A. DerMarderosian, "Hermeticity and moisture ingress", NBSIR 84-2852, RADC/NBS Workshop, Moisture Measurement and Control for Semiconductor Devices, III, May, 1984, pp. 196-216.
6. A. DerMarderosian, "Hermeticity-A Tutorial", Proceedings IRPS, 1984, pp. 1. 3-18 to 1. 3-33.
7. D. Stroehle, "On the penetration of gases and water vapour into packages with cavities and on maximum allowable leak rates", Proceedings IRPS, 1980, pp. 101-106.
8. K. Winkelmann, private communication viii R. A. Clarke, A. DerMarderosian, "Variable leak rate phenomena in glass-to-metal seals", Intl. Symposium on Microelectronics, 1998, pp. 828-832
9. R. C. Kullberg, D. J. Rossiter, ""Measuring Mass Flows in Hermetically Sealed MEMs & MOEMs to Ensure Device Reliability. " SPIE, January 2008, in process, #6884-19
10. J. G. Davy, IEEE Transactions, ibid
11. F. Sciuccati, G. Gasparini, B. Ferrario, "Outgassing characteristics of some thermal insulating and constructional materials used in vacuum applications. " Vuoto, Vol. XVIII, N. 4, Ottobre-Dicembre 1998
12. A. Corazza, R. C. Kullberg, "Vacuum Maintenance In Hermetically Sealed MEMs Packages," Proceedings of the SPIE, Vol. 3514 p. 82-89 (1998)
13. R. C. Kullberg, D. J. Rossiter, ibid