Substitution of formaldehyde based adhesives with soy based adhesives in production of low formaldehyde emission wood based panels. Part 1 - Plywood

International Wood Products Journal

Volumn 4, Issue 1, 2013, Pages 30-32

  Guezguez, B ^a   Irle, M ^a   Belloncle, C ^a  

^a Ecole Supérieure du Bois   (France)

Author keywords

Bond quality; Formaldehyde emission; Melamine urea formaldehyde; Plywood; Soy adhesive system

Indexed keywords

ADHESIVE SYSTEMS; BOND QUALITY; FORMALDEHYDE EMISSION; FORMALDEHYDE RELEASE; MELAMINE UREA FORMALDEHYDES; PLYWOOD PRODUCTION; SOY BASED ADHESIVE; WOOD-BASED PANELS;

METABOLISM; PLYWOOD; UREA; WOOD PRODUCTS;

FORMALDEHYDE;

ADHESIVES; EMISSION; MELAMINE; METABOLISM; PLY WOOD; POLYUREAS; WOOD PRODUCTS;

EID: 84877249030     PISSN: 20426445     EISSN: 20426453     Source Type: Journal    
DOI: 10.1179/2042645311Y.0000000023     Document Type: Article

References (12)

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