An above IC MEMS RF Switch

IEEE Journal of Solid-State Circuits

Volumn 38, Issue 12, 2003, Pages 2318-2324

  Saias, Daniel ^a   Robert, Philippe ^b   Boret, Samuel ^a   Billard, Christophe ^b   Bouche, Guillaume ^a   Belot, Didier ^a   Ancey, Pascal ^a  

^a STMICROELECTRONICS   (France)

^b CEA GRENOBLE   (France)

Author keywords

Microelectromechanical devices (MEMs); Radio communication; Switches

Indexed keywords

ACOUSTIC RESONATORS; BANDWIDTH; CMOS INTEGRATED CIRCUITS; OPTIMIZATION; RADIO COMMUNICATION; RELIABILITY; SWITCHES; SWITCHING;

RADIO FREQUENCY (RF) SYSTEMS; THIN FILM BULK ACOUSTIC RESONATORS;

MICROELECTROMECHANICAL DEVICES;

EID: 0347603231     PISSN: 00189200     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSSC.2003.819170     Document Type: Conference Paper

References (10)

1. G. M. Rebeiz, RF MEMS, Theory, Design, and Technology. New York: Wiley, 2003.
2. J. J. Yao, "RF MEMS from a device perspective," J. Micromech. Microeng., pp. 9-38, Oct. 2000.
3. C. Tinella et al., "A 0.7 dB insertion loss CMOS SOI antenna switch with moore than 50 db isolation over the 2.5 to 5 GHz band," Proc. ESSCIRC, pp. 483-486, 2002.
4. Z. J. Yao et al., "Micromachined low loss microwave switches," J. Microelectromech. Syst., vol. 8, pp. 129-134, Aug. 1999.
5. M.Ruan et al., "Latching micromagnetic relays,"J. Micromechan. Syst., vol. 10, no. 4, pp. 511-517, 2001.
6. G. Klaasse, R. Puers, and H.A.C. Tilmans, "Piezoelectric versus electrostatic actuation for a capacitive RF-MEMS switch," in SeSens Proc., Veldhoven, The Netherlands, Nov. 2002, pp. 631-634.
7. G. M. Rebeiz and J. B. Muldavin, "RF MEMS switches and switch circuits," IEEE Microwave, pp. 59-71, Dec. 2001.
8. N. E. Gruer et al., Reliability Physics of MEMS Microswitch Contacts. Boston, MA: Northern Univ.
9. D. Saias et al, "An integrated RF-MEMS switching solution for standard technology," in IEEE Int. Solid-State Circuits Conf. Dig. Tech. Papers, Feb. 2003, pp. 206-207.
10. P. Robert et al., "Integrated RF MEMS switch based on a combination of thermal and electrostatic actuation," in Proc. Transducers, June 2003, pp. 1714-1717.