Encapsulation of power modules for extreme environment electronics

Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009

Volumn , Issue , 2009, Pages 678-685

  Rao, Gona ^a   Kulkarni, Srikanth ^a   Barlow, Fred ^a   Elshabini, Aicha ^a  

^a UNIVERSITY OF IDAHO   (United States)

Author keywords

Encapsulants; Extreme environments; GaN; Housings; SiC

Indexed keywords

DIELECTRIC BREAKDOWN STRENGTH; ENCAPSULANTS; ENVIRONMENTAL CONDITIONS; EXTREME ENVIRONMENT; GAN; MAXIMUM SERVICE TEMPERATURE; POWER ELECTRONIC MODULES; SIC;

ELECTRIC BREAKDOWN; ELECTRIC POWER SYSTEMS; GALLIUM ARSENIDE; GALLIUM NITRIDE; GELS; HOUSING; MATERIALS; MICROELECTRONICS; SEMICONDUCTING GALLIUM; SILICON; SILICON CARBIDE;

DATA ENCAPSULATION;

EID: 84876948326     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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