TEM microstructural analysis of intermetallic phases formed during wire bonding and annealing in the Au-Al system

Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005

Volumn , Issue , 2005, Pages 325-332

  Karpel, Adi ^a   Kaplan, Wayne D ^a   Atzmon, Ziv ^b   Gur, Giyora ^b  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

^b Kulicke and Soffa Bonding Tools   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED TEST METHODS; ENERGY DISPERSIVE SPECTROSCOPIES (EDS); HIGH-ANGLE ANNULAR DARK FIELDS; MICRO-STRUCTURAL CHARACTERIZATION; MICROSTRUCTURAL ANALYSIS; SCANNING AND TRANSMISSION ELECTRON MICROSCOPY; SCANNING TRANSMISSION ELECTRON MICROSCOPY; SPECIMEN PREPARATION METHOD;

ALUMINUM; ATMOSPHERIC PRESSURE; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; METASTABLE PHASES; MICROELECTRONICS; MICROSTRUCTURE; PHASE DIAGRAMS; TESTING; TRANSMISSION ELECTRON MICROSCOPY;

SPECIMEN PREPARATION;

EID: 84876923588     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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